SA58631 NXP Semiconductors, SA58631 Datasheet - Page 15

• Manufacturer Part Number: SA58631
• Manufacturer: NXP Semiconductors

NXP Semiconductors
15. Package outline
Fig 22. Package outline SOT909-1 (HVSON8)
SA58631_2
Product data sheet
HVSON8: plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 4 x 4 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT909-1
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
X
E
L
h
0.4
0.3
b
IEC
0.2
c
1
8
D
4.1
3.9
e
(1)
3.25
2.95
D h
D
e
D
MO-229
1
h
JEDEC
E
4.1
3.9
(1)
b
REFERENCES
Rev. 02 — 12 October 2007
2.35
2.05
E h
5
4
0.8
e
JEITA
B
2.4
e 1
w
v
A
E
M
M
C
C
0.65
0.40
L
A
B
0.1
v
A
A
0.05
1
y
w
1
C
0.05
0
y
PROJECTION
detail X
EUROPEAN
0.1
y 1
scale
1
3 W BTL audio amplifier
exposed tie bar (4 )
C
2 mm
y
SA58631
© NXP B.V. 2007. All rights reserved.
ISSUE DATE
05-09-26
05-09-28
c
SOT909-1
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