SA58632 NXP Semiconductors, SA58632 Datasheet - Page 24
SA58632
Manufacturer Part Number
SA58632
Description
Manufacturer
NXP Semiconductors
Datasheet
1.SA58632.pdf
(28 pages)
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NXP Semiconductors
17. Abbreviations
SA58632_2
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Table 10.
Acronym
BTL
CMOS
DAP
ESD
NPN
PCB
PNP
RMS
SE
THD
Fig 25. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Bridge-Tied Load
Complementary Metal Oxide Semiconductor
Die Attach Paddle
ElectroStatic Discharge
Negative-Positive-Negative
Printed-Circuit Board
Positive-Negative-Positive
Root Mean Squared
Single-Ended
Total Harmonic Distortion
Rev. 02 — 4 March 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
2 × 2.2 W BTL audio amplifier
temperature
peak
SA58632
© NXP B.V. 2010. All rights reserved.
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