SA58672 NXP Semiconductors, SA58672 Datasheet - Page 19

• Manufacturer Part Number: SA58672
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Fig 17. Package outline WLCSP9
SA58672_4
Product data sheet
WLCSP9: wafer level chip-size package; 9 bumps; 1.66 x 1.71 x 0.6 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SA58672UK
VERSION
OUTLINE
max
0.64
A
0.26
0.22
A
1
bump A1
index area
bump A1
index area
0.38
0.34
A
2
IEC
C
B
A
0.34
0.30
b
1
1.69
1.63
e
D
e
D
2
1
b
1.74
1.68
JEDEC
E
3
REFERENCES
0.5
e
0
A
e
Rev. 04 — 8 June 2009
e
1
1
w
v
e
B
E
2
M
M
JEITA
C
C
e
1
2
scale
A
1
B
0.15
v
0.05
w
2 mm
0.08
A
y
A
2
3.0 W mono class-D audio amplifier
A
1
detail X
PROJECTION
EUROPEAN
X
C
y
SA58672
© NXP B.V. 2009. All rights reserved.
ISSUE DATE
08-06-12
SA58672UK
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