BAP50-04 NXP Semiconductors, BAP50-04 Datasheet - Page 3

• Manufacturer Part Number: BAP50-04
• Description: Two planar PIN diodes in series configuration in an SOT23 small plastic SMD package
• Manufacturer: NXP Semiconductors

NXP Semiconductors
ELECTRICAL CHARACTERISTICS
T
Note
1. Guaranteed on AQL basis: inspection level S4, AQL 1.0.
THERMAL CHARACTERISTICS
1999 Dec 03
Per diode
V
V
I
C
r

L
R
j
SYMBOL
R
SYMBOL
D
L
S
= 25 C unless otherwise specified.
F
R
General purpose PIN diode
d
th j-s
forward voltage
reverse voltage
reverse current
diode capacitance
diode forward resistance
charge carrier life time
series inductance
thermal resistance from junction to soldering point
PARAMETER
I
I
V
V
V
V
I
I
I
when switched from I
R
PARAMETER
F
R
F
F
F
R
R
R
R
L
= 50 mA
= 0.5 mA; f = 100 MHz; note 1
= 1 mA; f = 100 MHz; note 1
= 10 mA; f = 100 MHz; note 1
= 10 A
100 ; measured at I
= 50 V
= 0; f = 1 MHz
= 1 V; f = 1 MHz
= 5 V; f = 1 MHz
CONDITIONS
3
F
10 mA to I
R
3 mA
R
6 mA;

50









MIN.
VALUE
220
0.95


0.45
0.35
0.3
25
14
3
1.05
1.4
TYP.
Product specification
BAP50-04
1.1

100

0.6
0.5
40
25
5


MAX. UNIT
UNIT
K/W
V
V
nA
pF
pF
pF



s
nH