BAP50-04 NXP Semiconductors, BAP50-04 Datasheet - Page 4

Two planar PIN diodes in series configuration in an SOT23 small plastic SMD package

BAP50-04

Manufacturer Part Number
BAP50-04
Description
Two planar PIN diodes in series configuration in an SOT23 small plastic SMD package
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
GRAPHICAL DATA
1999 Dec 03
handbook, halfpage
handbook, halfpage
General purpose PIN diode
Fig.2
(1) I
Diode inserted in series with a 50  stripline circuit and
biased via the analyzer Tee network.
T
Fig.4
|
f = 100 MHz; T
S 21
(dB)
amb
(Ω)
r
10
D
10
|
−1
−2
−3
−4
−5
F
= 25 C.
10
2
10
0
1
= 10 mA.
3
2
0.5
−2
Forward resistance as a function of the
Insertion loss (S
forward current; typical values.
as a function of frequency; typical values.
j
= 25 C.
1
10
(2) I
−1
1.5
F
= 1 mA.
21
2
) of the diode in on-state
2
(1)
(2)
(3)
1
I F (mA)
(3) I
2.5
f (GHz)
F
MGS319
MGS317
= 0.5 mA.
10
3
4
handbook, halfpage
handbook, halfpage
f = 1 MHz; T
Fig.3
Diode zero biased and inserted in series with a 50  stripline circuit.
T
Fig.5
|
S 21
(dB)
amb
(fF)
C d
600
400
200
−10
−15
−20
−25
|
−5
= 25 C.
2
0
0
0.5
0
Diode capacitance as a function of reverse
voltage; typical values.
Isolation (S
a function of frequency; typical values.
j
= 25 C.
1
5
21
1.5
2
) of the diode in off-state as
10
2
Product specification
15
2.5
BAP50-04
V R (V)
f (GHz)
MGS320
MGL927
20
3

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