BB156 NXP Semiconductors, BB156 Datasheet
BB156
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BB156 Summary of contents
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... DATA SHEET BB156 Low-voltage variable capacitance diode Product specification Supersedes data of 1998 Aug 17 DISCRETE SEMICONDUCTORS 2004 Mar 01 ...
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... Very small plastic SMD package C7.5: 4.8 pF; ratio 3.3 Very low series resistance. APPLICATIONS Voltage controlled oscillators (VCO). DESCRIPTION The BB156 is a planar technology variable capacitance diode SOD323 very small plastic SMD package. ORDERING INFORMATION TYPE NUMBER NAME ...
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... V; see Fig C; see Fig 470 MHz MHz; see Figs 2 and 7 MHz 3 Product specification BB156 MIN. TYP. MAX. UNIT 200 nA 0.4 0.7 14.4 16 17.6 pF 7.6 8.6 9 ...
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... Mar 01 1 mlc816 handbook, halfpage 60 80 100 T (° Fig ( − C. j Temperature coefficient of diode capacitance as a function of reverse voltage; typical values. Product specification BB156 MGR466 2 10 MBH583 (V) R ...
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... Note 1. The marking bar indicates the cathode OUTLINE VERSION IEC SOD323 2004 Mar scale 1.8 1.35 2.7 0.45 0.25 0.2 1.6 1.15 2.3 0.15 0.15 REFERENCES JEDEC JEITA SC-76 5 Product specification detail EUROPEAN ISSUE DATE PROJECTION BB156 SOD323 Q c 03-12-17 06-03-16 ...
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... Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. 6 Product specification BB156 DEFINITION ...
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... NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 7 Product specification BB156 ...
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... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...