BAT54J NXP Semiconductors, BAT54J Datasheet - Page 3

• Manufacturer Part Number: BAT54J
• Description: Planar Schottky barrier single diode with an integrated guard ring for stress protection,encapsulated in a SOD323F (SC-90) very small and flat lead Surface-Mounted Device(SMD) plastic package
• Manufacturer: NXP Semiconductors

NXP Semiconductors
6. Thermal characteristics
7. Characteristics
BAT54J_1
Product data sheet
Table 6.
[1]
[2]
[3]
Table 7.
T
[1]
Symbol
R
R
Symbol
V
I
C
R
amb
F
th(j-a)
th(j-sp)
d
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Reflow soldering is the only recommended soldering method.
Soldering point of cathode tab.
Pulse test: t
= 25 C unless otherwise specified.
Parameter
forward voltage
reverse current
diode capacitance
Thermal characteristics
Characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
p
300 s;
Rev. 01 — 8 March 2007
0.02.
Conditions
I
I
I
I
I
V
V
F
F
F
F
F
R
R
= 0.1 mA
= 1 mA
= 10 mA
= 30 mA
= 100 mA
= 25 V
= 1 V; f = 1 MHz
Conditions
in free air
[1][2]
Schottky barrier single diode
[3]
[1]
Min
-
-
Min
-
-
-
-
-
-
-
Typ
-
-
Typ
-
-
-
-
-
-
-
© NXP B.V. 2007. All rights reserved.
BAT54J
Max
230
55
Max
240
320
400
500
800
2
10
2
.
Unit
K/W
K/W
Unit
mV
mV
mV
mV
mV
pF
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A