BAT54L NXP Semiconductors, BAT54L Datasheet - Page 2

Planar Schottky barrier diode encapsulated in a SOD882leadless ultra small plastic package

BAT54L

Manufacturer Part Number
BAT54L
Description
Planar Schottky barrier diode encapsulated in a SOD882leadless ultra small plastic package
Manufacturer
NXP Semiconductors
Datasheet

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NXP Semiconductors
FEATURES
• Low forward voltage
• Leadless ultra small plastic package
• Boardspace 1.17 mm
• Power dissipation comparable to SOT23.
APPLICATIONS
• Ultra high-speed switching
• Voltage clamping
• Protection circuits
• Mobile communication, digital (still) cameras, PDAs and
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. Refer to SOD882 standard mounting conditions (footprint), FR4 printed-circuit board with 60 μm copper strip line.
2003 Jun 23
V
I
I
I
P
T
T
F
FRM
FSM
SYMBOL
(1 mm × 0.6 mm × 0.5 mm)
PCMCIA cards.
stg
j
R
tot
Schottky barrier diode
continuous reverse voltage
continuous forward current
repetitive peak forward current
non-repetitive peak forward current
total power dissipation
storage temperature
junction temperature
2
(approx. 10% of SOT23)
PARAMETER
t
t
T
p
p
amb
≤ 1s; δ ≤ 0.5
< 10 ms
2
≤ 25 °C; note 1
DESCRIPTION
Planar Schottky barrier diode encapsulated in a SOD882
leadless ultra small plastic package.
handbook, halfpage
CONDITIONS
Marking code: S3.
The marking bar indicates the cathode.
Fig.1 Simplified outline (SOD882) and symbol.
Bottom view
−65
MIN.
MDB391
30
200
300
600
250
+150
150
Product data sheet
MAX.
BAT54L
V
mA
mA
mA
mW
°C
°C
UNIT

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