PMEG3020EPA NXP Semiconductors, PMEG3020EPA Datasheet - Page 10

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection

PMEG3020EPA

Manufacturer Part Number
PMEG3020EPA
Description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with anintegrated guard ring for stress protection
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
10. Packing information
11. Soldering
PMEG3020EPA_1
Product data sheet
Table 8.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number
PMEG3020EPA
Fig 15. Reflow soldering footprint SOT1061
For further information and the availability of packing methods, see
2.3
Reflow soldering is the only recommended soldering method.
Packing methods
1.05
Package
SOT1061
0.6
Rev. 01 — 15 December 2009
0.55
solder paste = solder lands
solder resist
Description
4 mm pitch, 8 mm tape and reel
2 A low V
occupied area
2.1
1.3
0.4
0.5
1.6
1.7
F
0.5 (2×)
0.4 (2×)
MEGA Schottky barrier rectifier
PMEG3020EPA
Section
Dimensions in mm
[1]
14.
0.5 (2×)
sot1061_fr
0.25
0.25
0.25
Packing quantity
3000
-115
© NXP B.V. 2009. All rights reserved.
0.6 (2×)
1.1
1.2
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