PMEG4010ETP NXP Semiconductors, PMEG4010ETP Datasheet - Page 3

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package

PMEG4010ETP

Manufacturer Part Number
PMEG4010ETP
Description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
5. Limiting values
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
[4]
6. Thermal characteristics
Table 6.
[1]
[2]
[3]
[4]
[5]
[6]
PMEG4010ETP
Product data sheet
Symbol
V
I
I
P
T
T
T
Symbol
R
R
F(AV)
FSM
j
amb
stg
R
tot
th(j-a)
th(j-sp)
Device mounted on a ceramic Printed-Circuit Board (PCB), Al
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses P
significant part of the total power losses.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Device mounted on a ceramic PCB, Al
Soldering point of cathode tab.
Limiting values
Thermal characteristics
Parameter
reverse voltage
average forward current
non-repetitive peak forward
current
total power dissipation
junction temperature
ambient temperature
storage temperature
Parameter
thermal resistance
from junction to
ambient
thermal resistance
from junction to solder
point
2
O
3
Conditions
in free air
, standard footprint.
All information provided in this document is subject to legal disclaimers.
Conditions
T
square wave; δ = 0.5; f = 20 kHz;
T
square wave; δ = 0.5; f = 20 kHz;
T
square wave; t
T
Rev. 1 — 5 October 2011
j
amb
sp
amb
= 25 °C
≤ 165 °C
≤ 145 °C
≤ 25 °C
2
O
3
, standard footprint.
p
= 8 ms; T
40 V, 1 A low VF MEGA Schottky barrier rectifier
j(init)
= 25 °C
[1][2][3]
[1][4][3]
[1][5][3]
[6]
PMEG4010ETP
2
2
.
.
[1]
[2][3]
[4][3]
[1][3]
Min
-
-
-
-
Min
-
-
-
-
-
-
-
-
-55
-65
Typ
-
-
-
-
© NXP B.V. 2011. All rights reserved.
175
175
Max
40
1
1
50
750
1250
2500
175
Max
200
120
60
12
R
are a
Unit
V
A
A
A
mW
mW
mW
°C
°C
°C
Unit
K/W
K/W
K/W
K/W
3 of 14

Related parts for PMEG4010ETP