BAV74 NXP Semiconductors, BAV74 Datasheet - Page 3
![The BAV74 consists of two high-speed switching diodeswith common cathodes, fabricated in planar technology,and encapsulated in a small SOT23 plastic SMD package](/photos/41/52/415233/sot023_3d_sml.gif)
BAV74
Manufacturer Part Number
BAV74
Description
The BAV74 consists of two high-speed switching diodeswith common cathodes, fabricated in planar technology,and encapsulated in a small SOT23 plastic SMD package
Manufacturer
NXP Semiconductors
Datasheet
1.BAV74.pdf
(9 pages)
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NXP Semiconductors
ORDERING INFORMATION
ELECTRICAL CHARACTERISTICS
T
THERMAL CHARACTERISTICS
Note
1. Device mounted on an FR4 printed-circuit board.
2004 Jan 14
BAV74
Per diode
V
I
C
t
V
R
R
j
R
rr
SYMBOL
SYMBOL
TYPE NUMBER
= 25 °C unless otherwise specified.
F
fr
High-speed double diode
d
th(j-tp)
th(j-a)
forward voltage
reverse current
diode capacitance
reverse recovery time
forward recovery voltage
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
PARAMETER
NAME
−
PARAMETER
plastic surface mounted package; 3 leads
see Fig.3
see Fig.5
f = 1 MHz; V
when switched from I
I
at I
when switched from I
t
R
r
= 20 ns; see Fig.8
I
I
I
V
V
V
V
= 10 mA; R
F
F
F
R
R
R
R
R
= 1 mA
= 10 mA
= 100 mA
= 1 mA; see Fig.7
= 25 V
= 50 V
= 25 V; T
= 50 V; T
3
CONDITIONS
DESCRIPTION
R
note 1
PACKAGE
L
= 0; see Fig.6
j
j
= 100 Ω; measured
= 150 °C
= 150 °C
CONDITIONS
F
F
= 10 mA to
= 10 mA;
715
855
1.0
30
0.1
30
100
1.5
4
1.75
VALUE
MAX.
360
500
Product data sheet
mV
mV
V
nA
µA
µA
µA
pF
ns
V
VERSION
BAV74
SOT23
UNIT
UNIT
K/W
K/W