IP4060CX16LF NXP Semiconductors, IP4060CX16LF Datasheet - Page 8

• Manufacturer Part Number: IP4060CX16LF
• Description: The IP4060CX16/LF is a diode array with integrated EMI/RF filters and pull-up resistors,which is designed to protect downstream components from ElectroStatic Discharge (ESD)voltages up to +-15 kV, far exceeding IEC 61000-4-2 standard, level 4
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Abbreviations
10. Revision history
Table 7.
IP4060CX16LF_1
Product data sheet
Document ID
IP4060CX16LF_1
Revision history
8.3.4 Cleaning
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description” .
Cleaning can be done after reflow soldering.
Table 6.
Acronym
EMI
ESD
LAN
MMC
PCS
PDA
RFI
WAN
WLCSP
Release date
20090514
Abbreviations
Description
ElectroMagnetic Interference
ElectroStatic Discharge
Local Area Network
MultiMediaCard
Personal Communication System
Personal Digital Assistant
Radio-Frequency Interference
Wide Area Network
Wafer-Level Chip-Scale Package
Data sheet status
Product data sheet
High-speed MultiMediaCard interface filter with ESD protection
Rev. 01 — 14 May 2009
Change notice
-
IP4060CX16/LF
Supersedes
-
© NXP B.V. 2009. All rights reserved.
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