IP4365CX11 NXP Semiconductors, IP4365CX11 Datasheet - Page 8

• Manufacturer Part Number: IP4365CX11
• Description: The IP4365CX11 is a fully integrated smart card interface device according ISO/IEC 7816-3 for the Subscriber Identity Module (SIM) card interface and according ISO/IEC 7816-12 for the Universal Subscriber Identity Module (USIM) Universal Serial Bus (
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Design and assembly recommendations
IP4365CX11_1
Product data sheet
9.1 PCB design guidelines
9.2 PCB assembly guidelines for Pb-free soldering
For optimum performance it is recommended to use a Non-Solder Mask Defined (NSMD),
also known as a copper-defined design, incorporating laser-drilled micro-vias connecting
the ground pads to a buried ground-plane layer. This results in the lowest possible ground
inductance and provides the best high frequency and ESD performance. For this case,
refer to
Table 6.
Table 7.
Parameter
PCB pad diameter
Micro-via diameter
Solder mask aperture diameter
Copper thickness
Copper finish
PCB material
Parameter
Solder screen aperture diameter
Solder screen thickness
Solder paste: Pb-free
Solder / flux ratio
Solder reflow profile
Fig 9.
Table 6
The device is capable of withstanding at least three reflows of this profile.
Pb-free solder reflow profile
Recommended PCB design parameters
Assembly recommendations
All information provided in this document is subject to legal disclaimers.
for the recommended PCB design parameters.
T
reflow(peak)
Integrated SIM card passive filter array and USB ESD protection
Rev. 01 — 26 March 2010
( C)
250
230
217
T
pre-heat
t
1
Value or specification
200 μm
100 μm (0.004 inch)
370 μm
20 μm to 40 μm
AuNi
FR4
Value or specification
330 μm
100 μm (0.004 inch)
SnAg (3 % to 4 %) Cu (0.5 % to 0.9 %)
50 / 50
see
t
5
Figure 9
t
2
t
t
3
4
cooling rate
IP4365CX11
001aai943
t (s)
© NXP B.V. 2010. All rights reserved.
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