NX3008CBKV NXP Semiconductors, NX3008CBKV Datasheet - Page 17

• Manufacturer Part Number: NX3008CBKV
• Description: Complementary N/P-channel enhancement mode Field-Effect Transistor (FET) in an ultra small and flat lead SOT666 Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology
• Manufacturer: NXP Semiconductors

NXP Semiconductors
10. Soldering
NX3008CBKV
Product data sheet
Fig 33. Reflow soldering footprint for SOT666 (SOT666)
2
1.7
1.075
0.538
0.55
(2×)
0.45
(4×)
(4×)
0.5
All information provided in this document is subject to legal disclaimers.
2.75
2.45
2.1
1.6
1.7
Rev. 1 — 29 July 2011
0.65
(2×)
(2×)
0.6
30 / 30 V, 400 / 220 mA N/P-channel Trench MOSFET
(6×)
0.4
0.325
0.25
(2×)
(4×)
0.375
(2×)
(4×)
0.3
Dimensions in mm
NX3008CBKV
solder lands
placement area
solder paste
occupied area
sot666_fr
© NXP B.V. 2011. All rights reserved.
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