NX3008PBKT NXP Semiconductors, NX3008PBKT Datasheet - Page 12

P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT416 (SC-75) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology

NX3008PBKT

Manufacturer Part Number
NX3008PBKT
Description
P-channel enhancement mode Field-Effect Transistor (FET) in a small SOT416 (SC-75) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
10. Soldering
NX3008PBKT
Product data sheet
Fig 19. Reflow soldering footprint for SOT416 (SOT416)
0.85
(3×)
0.6
All information provided in this document is subject to legal disclaimers.
2.2
1.3
1.7
Rev. 1 — 1 August 2011
(3×)
0.5
1
2
30 V, 200 mA P-channel Trench MOSFET
Dimensions in mm
solder lands
solder resist
solder paste
occupied area
NX3008PBKT
sot416_fr
© NXP B.V. 2011. All rights reserved.
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