BLF177 NXP Semiconductors, BLF177 Datasheet - Page 14
BLF177
Manufacturer Part Number
BLF177
Description
Manufacturer
NXP Semiconductors
Datasheet
1.BLF177.pdf
(19 pages)
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NXP Semiconductors
handbook, full pagewidth
HF/VHF power MOS transistor
Dimensions in mm.
The circuit and components are situated on one side of the PTFE fibre-glass board, the other side being fully metallized to serve as a ground.
Earth connections are made by means of hollow rivets, whilst under the source leads and at the input and output copper straps are used for a
direct contact between upper and lower sheets.
strap
C1
C2
C3
Fig.20 Component layout for 108 MHz class-B test circuit.
L1
C4
C5
L2
R1
R3
Rev. 06 - 24 January 2007
C8
R4
R2
L3
C6
C7
174
strap
C9
L4
C10
L5
C11
L7
rivet
R5
R6
L6
C13
C14
C12
V D
L8
C19
C15
C16
Product specification
C18
strap
MGP105
C17
BLF177
14 of 19
70
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