750340-1 TE Connectivity, 750340-1 Datasheet - Page 2

• Manufacturer Part Number: 750340-1
• Manufacturer: TE Connectivity

Specifications of 750340-1

• Product Type: Connector
• Pcb Mounting Orientation: Vertical
• Front Panel Grounding: With
• Front Panel Screw-down: With
• Pcb Mount Retention: Without
• Gender: Receptacle
• Stacked: No
• Color Code: None
• Pcb Mount Style: Through Hole
• Inner Shield Material: Copper Alloy
• Outer Shield Material: Copper Alloy
• Shielded: Yes
• Grounding Clips: Without
• Solder Tail Contact Plating: Tin-Lead
• Connector Configuration: Mini DIN
• Number Of Positions: 8
• Inner Shield Plating: Tin-lead over Nickel
• Outer Shield Plating: Tin-lead over Copper
• Contact Plating, Mating Area, Material: Gold (15)
• Contact Base Material: Copper Alloy
• Underplate Material: Nickel
• Housing Material: Thermoplastic - GF
• Ul Flammability Rating: UL 94V-0
• Housing Color: Black
• Spdif Connector: Without
• Rohs/elv Compliance: ELV compliant, 5 of 6 Compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C

3.4.
3.5.
Rev F
Examination of product.
Termination resistance.
Insulation resistance.
Dielectric withstanding voltage.
Transfer impedance.
Solderability.
Vibration, random.
Physical shock.
Performance and Test Description
Product is designed to meet electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions per Test Specification 109-1.
Test Requirements and Procedures Summary
Test Description
Meets requirements of product
drawing.
20 milliohms maximum initial.
30 milliohms maximum final.
1000 megohms minimum.
500 vac at sea level.
30 MHz, -18 dB ohm or better.
160 MHz, -5 dB ohm or better.
See Note.
No discontinuities of 1 microsecond
or longer duration.
See Note.
No discontinuities of 1 microsecond
or longer duration.
See Note.
Figure 1 (continued)
MECHANICAL
ELECTRICAL
Requirement
Visual, dimensional and functional
per applicable quality inspection
plan.
TE 109-6-1.
Subject mated contacts assembled
in housing to 50 mv maximum
open circuit at 100 ma maximum.
See Figure 3.
TE Spec 109-28-4.
Test between adjacent contacts of
unmated samples.
TE Spec 109-29-1.
Test between adjacent contacts of
unmated samples.
TE Spec 109-175.
Measure transfer impedance of
mated samples with front panel
grounding finger.
TE Spec 109-11-1.
Subject samples to solderability.
TE Spec 109-21-5.
Subject mated samples to 16.91
G's rms. 20 minutes in each of 3
mutually perpendicular planes.
See Figure 4.
TE Spec 109-26-1.
Subject mated samples to 50 G's
half-sine shock pulses of 11
milliseconds duration. 3 shocks in
each direction applied along 3
mutually perpendicular planes, 18
total shocks.
See Figure 4.
Procedure
108-1225
2 of 6