MC3302PG ON Semiconductor, MC3302PG Datasheet - Page 11
![IC COMP QUAD SINGLE SUPPLY 14DIP](/photos/6/58/65803/14-dip_646-06_sml.jpg)
MC3302PG
Manufacturer Part Number
MC3302PG
Description
IC COMP QUAD SINGLE SUPPLY 14DIP
Manufacturer
ON Semiconductor
Type
General Purposer
Specifications of MC3302PG
Number Of Elements
4
Output Type
CMOS, Open-Collector, TTL
Voltage - Supply
3 V ~ 30 V, ±1.5 V ~ 15 V
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Number Of Channels
4 Channels
Response Time
1.3 us
Offset Voltage (max)
20 mV
Input Bias Current (max)
500 nA
Supply Voltage (max)
30 V
Supply Voltage (min)
3 V
Supply Current (max)
2.5 mA
Maximum Power Dissipation
1000 mW
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Amplifier Type
Comparator
Current, Input Bias
25 nA
Current, Input Offset
±3 nA
Current, Supply
1 mA
Number Of Amplifiers
Quad
Package Type
SOIC-14
Power Dissipation
1 W
Temperature, Operating, Range
-40 to +85 °C
Voltage, Gain
100 V/mV
Voltage, Input Offset
±3 mVDC
Voltage, Supply
±18 VDC
Comparator Type
General Purpose
No. Of Comparators
4
Ic Output Type
CMOS, TTL
Supply Current
1mA
Supply Voltage Range
3V To 30V
Amplifier Case Style
DIP
No. Of Pins
14
Rohs Compliant
Yes
Output Compatibility
CMOS, TTL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC3302PGOS
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC3302PG
Manufacturer:
ON
Quantity:
7 700
Company:
Part Number:
MC3302PG
Manufacturer:
ON Semiconductor
Quantity:
4
−T−
0.15 (0.006) T
0.15 (0.006) T
0.10 (0.004)
SEATING
PLANE
L
U
U
PIN 1
IDENT.
2X
D
S
S
L/2
C
14
1
0.36
G
14X
14X
*For additional information on our Pb−Free strategy and soldering
−V−
A
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
K
0.10 (0.004)
REF
8
7
M
−U−
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
1
B
T
H
1.26
14X
U
http://onsemi.com
J J1
N
CASE 948G−01
S
N
TSSOP−14
DETAIL E
ISSUE B
V
7.06
S
DETAIL E
11
SECTION N−N
Ç Ç Ç
É É É
Ç Ç Ç
É É É
F
K1
K
0.25 (0.010)
M
DIMENSIONS: MILLIMETERS
−W−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE DAMBAR
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
0.65
PITCH
ANSI Y14.5M, 1982.
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IN EXCESS OF THE K DIMENSION AT
MAXIMUM MATERIAL CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
K1
J1
A
B
C
D
G
H
K
M
F
J
L
MILLIMETERS
MIN
4.90
4.30
0.05
0.50
0.50
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
5.10 0.193
4.50 0.169
1.20
0.15 0.002
0.75 0.020
0.60 0.020
0.20 0.004
0.16 0.004
0.30 0.007
0.25 0.007
8
_
MIN
−−− 0.047
0.026 BSC
0.252 BSC
0
INCHES
_
0.200
0.177
0.006
0.030
0.024
0.008
0.006
0.012
0.010
MAX
8
_