1735438-4 TE Connectivity, 1735438-4 Datasheet
1735438-4
Manufacturer Part Number
1735438-4
Description
Manufacturer
TE Connectivity
Specifications of 1735438-4
Socket Style
Mini DIMM
Dram Type
Double Data Rate (DDR) III
Pcb Mount Style
Surface Mount
Module Orientation
Right Angle
Holddown Material
Copper Alloy
Pcb Mount Retention
With
Profile
Standard
Center Retention Hole Diameter (mm [in])
2.50 [0.098]
Keying
Standard
Holddown Plating
Tin
Dram Voltage
1.5 V
Solder Tail Contact Plating
Gold Flash over Nickel
Height Above Pc Board (mm [in])
9.79 [0.385]
Socket Type
Memory Card
Number Of Positions
244
Row-to-row Spacing (mm [in])
8.70 [0.343]
Centerline (mm [in])
0.60 [0.024]
Number Of Rows
Dual
Ejector Type
Standard
Ejector Location
Both Ends
Center Post
With
Number Of Keys
1
Number Of Holddowns
6
Ejector Material Color
Natural
Ejector Material
Liquid Crystal Polymer (LCP)
Locating Post(s)
With
Pcb Mount Retention Type
Solder Peg
Center Post Material
Liquid Crystal Polymer (LCP)
Latch Material
Liquid Crystal Polymer (LCP)
Mount Type
Printed Circuit Board
Module Key Type
Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation
Contact Plating, Mating Area, Material
Gold (30)
Contact Base Material
Copper Alloy
Retention Post(s) Location
None
Housing Material
Liquid Crystal Polymer (LCP)
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Insertion Style
Direct Insert
Center Key (mm [in])
None
Latch Color
Natural
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Application Type
DDR III
Packaging Method
Hard Tray
Packaging Quantity
15/Tray
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
1735438-4
Manufacturer:
TE/泰科
Quantity:
20 000
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