1735438-4 TE Connectivity, 1735438-4 Datasheet

1735438-4

Manufacturer Part Number
1735438-4
Description
Manufacturer
TE Connectivity
Datasheets

Specifications of 1735438-4

Socket Style
Mini DIMM
Dram Type
Double Data Rate (DDR) III
Pcb Mount Style
Surface Mount
Module Orientation
Right Angle
Holddown Material
Copper Alloy
Pcb Mount Retention
With
Profile
Standard
Center Retention Hole Diameter (mm [in])
2.50 [0.098]
Keying
Standard
Holddown Plating
Tin
Dram Voltage
1.5 V
Solder Tail Contact Plating
Gold Flash over Nickel
Height Above Pc Board (mm [in])
9.79 [0.385]
Socket Type
Memory Card
Number Of Positions
244
Row-to-row Spacing (mm [in])
8.70 [0.343]
Centerline (mm [in])
0.60 [0.024]
Number Of Rows
Dual
Ejector Type
Standard
Ejector Location
Both Ends
Center Post
With
Number Of Keys
1
Number Of Holddowns
6
Ejector Material Color
Natural
Ejector Material
Liquid Crystal Polymer (LCP)
Locating Post(s)
With
Pcb Mount Retention Type
Solder Peg
Center Post Material
Liquid Crystal Polymer (LCP)
Latch Material
Liquid Crystal Polymer (LCP)
Mount Type
Printed Circuit Board
Module Key Type
Per JEDEC MO-244, Module Variation AB/BB/CB, Standard Orientation
Contact Plating, Mating Area, Material
Gold (30)
Contact Base Material
Copper Alloy
Retention Post(s) Location
None
Housing Material
Liquid Crystal Polymer (LCP)
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Insertion Style
Direct Insert
Center Key (mm [in])
None
Latch Color
Natural
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C, Reflow solder capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Application Type
DDR III
Packaging Method
Hard Tray
Packaging Quantity
15/Tray

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
1735438-4
Manufacturer:
TE/泰科
Quantity:
20 000
1.
1.1.
1.2.
2.
2.1.
2.2.
©2009 Tyco Electronics Corporation,
Singapore
All International Rights Reserved
AMP-QA-182 REV. C
SCOPE
Content
This specification covers performance, tests and quality requirements for the Tyco Electronics 244
position surface mount Mini Dual In-Line Memory Module (DIMM) Right Angled socket used to
connect the Mini DIMM module to the motherboard.
Qualification
When tests are performed on the subject product line, procedures specified in paragraph 3.6 shall
be used. All inspections shall be performed using the applicable inspection plan and product
drawing.
APPLICABLE DOCUMENTS
The following documents form a part of this specification to the extent specified herein. Unless
otherwise specified, the latest edition of the document applies. In the event of conflict between the
requirements of this specification and the product drawing, the product drawing shall take
precedence. In the event of conflict between the requirements of this specification and the
referenced documents, this specification shall take precedence.
Tyco Electronics Documents
Commercial Standards
109-197
114-51011
501-51082
EIA-364
EIA/JESD22-B102
MO-244
E28476
Specification
Product
Socket, Mini DIMM, 0.60mm Pitch, 244CKTS, R/A
* Trademark
| Indicates change
AMP Test Specifications vs. EIA and IEC Test Methods
Application Specification
Qualification Test Report
Solderability
244 Pin DDR2 Mini DIMM, 0.60 Lead Centers
Electrical Connector/Socket Test Procedures Including Environmental
Classifications
UL Report on Component - Connectors For Use In Data, Signal, Control
And Power Applications
PRE:
APP:
SEE YUN JAAN
LEONG SEE FAN
108-51091
21 Jul 09
DCR No.
Initial Release
Rev A
LOC DY
1 of 7

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1735438-4 Summary of contents

Page 1

Product Specification Socket, Mini DIMM, 0.60mm Pitch, 244CKTS, R/A 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the Tyco Electronics 244 position surface mount Mini Dual In-Line Memory Module (DIMM) Right Angled socket used to ...

Page 2

REQUIREMENTS 3.1. Design and Construction Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. 3.2. Materials Materials used in the construction of this product shall be as specified on the applicable product ...

Page 3

Test Requirements and Procedures Summary S/n Test Items 3.6.1 Initial Examination of Product. 3.6.2 Final Examination of Product. 3.6.3 Termination Resistance. 3.6.4 Temperature Rise at Rated Current. 3.6.5 Insulation Resistance. 3.6.6 Dielectric Withstanding Voltage. Rev A Requirements Meets requirements ...

Page 4

S/n Test Items 3.6.7 Solderability. 3.6.8 Vibration. 3.6.9 Mechanical Shock, Specified Pulse. 3.6.10 Durability. 3.6.11 Module Insertion Force. 3.6.12 Module Rip-out Force. Rev A Requirements Mechanical Requirements Solderable area shall have minimum of 95% solder coverage. No discontinuities of 1 ...

Page 5

S/n Test Items 3.6.13 Thermal Shock. 3.6.14 Temperature/Humidity Cycling. 3.6.15 Temperature Life. Heat Resistance to Lead-Free 3.6.17 Reflow Soldering. NOTE Shall meet visual requirements, show no physical damage, and meet requirements of additional tests as specified in the Product Qualification ...

Page 6

Product Qualification and Re-qualification Test Sequence Test Items Initial examination of product Termination resistance Temperature rise at rated current. Insulation resistance Dielectric withstanding voltage Solderability Vibration Mechanical shock Durability Thermal shock Humidity-temperature cycling Temperature life Module Insertion Force. Module ...

Page 7

QUALITY ASSURANCE PROVISIONS 4.1. Qualification Testing A. Specimen Selection Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be selected at random from current production. B. Test Sequence Qualification inspection shall be verified by testing specimens ...

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