STM8AF6246 STMicroelectronics, STM8AF6246 Datasheet - Page 78
STM8AF6246
Manufacturer Part Number
STM8AF6246
Description
STM8AF62 Standard Line
Manufacturer
STMicroelectronics
Datasheet
1.STM8AF6168.pdf
(91 pages)
Specifications of STM8AF6246
Max Fcpu
16 MHz
Flash Program Memory
16 to 32 Kbytes Flash; data retention 20 years at 55 °C after 1 kcycle
Data Memory
0.5 to 1 Kbyte true data EEPROM; endurance 300 kcycles
Ram
1 to 2 Kbytes
Advanced Control Timer
16-bit, 4 CAPCOM channels, 3 complementary outputs, dead-time insertion and flexible synchronization
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Electrical characteristics
10.4
10.4.1
78/91
Thermal characteristics
In case the maximum chip junction temperature (T
operating conditions on page 51
guaranteed.
T
Where:
Table 48.
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
Reference document
JESD51-2 integrated circuits thermal test method environment conditions - natural
convection (still air). Available from www.jedec.org.
Jmax
environment.
Symbol
–
–
–
–
–
, in degrees Celsius, may be calculated using the following equation:
Θ
Θ
Θ
JA
JA
JA
T
Θ
P
P
chip internal power.
P
Where:
P
taking into account the actual V
in the application.
Amax
Dmax
INTmax
I/Omax
I/Omax
JA
Thermal characteristics
is the package junction-to-ambient thermal resistance in ° C/W
Thermal resistance junction-ambient
LQFP 48 - 7 x 7 mm
Thermal resistance junction-ambient
LQFP 32 - 7 x 7 mm
Thermal resistance junction-ambient
VFQFPN32
is the maximum ambient temperature in ° C
is the sum of P
= Σ (V
represents the maximum power dissipation on output pins
is the product of I
OL
*I
OL
) + Σ ((V
Doc ID 14952 Rev 5
T
INTmax
Jmax
is exceeded, the functionality of the device cannot be
Parameter
DD
= T
DD
(1)
and P
and V
Amax
-V
OL
OH
/I
I/Omax
OL
DD
)*I
+ (P
, expressed in Watts. This is the maximum
OH
and V
Dmax
),
Jmax
(P
OH
Dmax
) specified in
x Θ
/I
OH
JA
= P
of the I/Os at low and high level
)
INTmax
STM8AF61xx, STM8AF62xx
Table 23: General
+ P
Value
57
59
25
I/Omax
)
°C/W
°C/W
°C/W
Unit