PM6681A STMicroelectronics, PM6681A Datasheet - Page 44

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PM6681A

Manufacturer Part Number
PM6681A
Description
Dual synchronous step down controller with adjustable LDO
Manufacturer
STMicroelectronics
Datasheet

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Package mechanical data
11
44/47
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 18.
Table 19.
1. VFQFPN stands for thermally enhanced very thin fine pitch quad flat package no lead. Very thin:
2. Dimensions D2 and E2 are not in accordance with JEDEC.
A = 1.00 mm Max.
2.90
Min
Dim.
ddd
A1
A3
D2
E2
A
D
E
b
e
L
VFQFPN32 5 x 5 x 1.0 mm pitch 0.50
Exposed pad variations
(1)(2)
3.10
Typ
D2
0.18
4.85
4.85
Min
0.8
0.3
0
Max
3.20
See exposed pad variations
See exposed pad variations
Databook (mm)
2.90
Min
0.02
0.25
Typ
0.9
0.2
0.5
0.4
5
5
3.10
Typ
E2
(2)
(2)
Max
0.05
5.15
5.15
0.05
0.3
0.5
1
PM6681A
Max
3.20
®

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