MAX7370 Maxim, MAX7370 Datasheet - Page 36

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MAX7370

Manufacturer Part Number
MAX7370
Description
The MAX7370 I²C-interfaced peripheral provides microprocessors with management of up to 64 key switches, with optional GPIO and PWM-controlled LED drivers
Manufacturer
Maxim
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MAX7370ETG+
Manufacturer:
MAXIM/美信
Quantity:
20 000
with I
For the latest application details on WLP construction,
dimensions, tape-carrier information, PCB techniques,
bump-pad layout, and recommended reflow tempera-
ture profile, as well as the latest information on reli-
ability testing results, refer to Application Note 1891:
Wafer-Level Packaging (WLP) and Its Applications,
available at www.maxim-ic.com.
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
24 TQFN-EP
PACKAGE
25 WLP
8 x 8 Key-Switch Controller and LED Driver/GPIOs
TYPE
Wafer-Level Packaging (WLP)
2
C Interface and High Level of ESD Protection
Applications Information
PACKAGE
W252F2+1
T243A3+1
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CODE
Package Information
OUTLINE
21-0188
21-0453
NO.
PATTERN NO.
Application
Note 1891
Refer to
90-0122
LAND
PROCESS: BiCMOS
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed. pad.
**Future product—contact factory for availability.
MAX7370ETG+
MAX7370EWA+**
PART
-40NC to +85NC
-40NC to +85NC
TEMP RANGE
Ordering Information
Chip Information
MAX7370
PIN-PACKAGE
24 TQFN-EP*
25 WLP

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