NCS2201SN2T1 ON Semiconductor, NCS2201SN2T1 Datasheet - Page 12

IC COMP 1V LP ENABLE 6-TSOP

NCS2201SN2T1

Manufacturer Part Number
NCS2201SN2T1
Description
IC COMP 1V LP ENABLE 6-TSOP
Manufacturer
ON Semiconductor
Series
NCS2200r
Type
General Purposer
Datasheet

Specifications of NCS2201SN2T1

Number Of Elements
1
Output Type
Complementary, Rail-to-Rail
Voltage - Supply
0.85 V ~ 6 V
Mounting Type
Surface Mount
Package / Case
SC-74, SOT-457
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
NCS2201SN2T1OSTR
total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
Surface mount board layout is a critical portion of the
0.074
1.9
0.037
0.037
0.95
0.95
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
SOT23−5
0.094
2.4
0.5 mm (min)
0.039
1.0
inches
0.028
mm
NCS2200 Series
0.7
http://onsemi.com
QFN 2x2.2
1.9 mm
12
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.074
1.9
0.037
0.037
0.95
0.95
SOT23−6
0.094
2.4
0.039
1.0
inches
0.028
mm
0.7

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