NCS2201SN2T1 ON Semiconductor, NCS2201SN2T1 Datasheet - Page 14

• Manufacturer Part Number: NCS2201SN2T1
• Description: IC COMP 1V LP ENABLE 6-TSOP
• Manufacturer: ON Semiconductor
• Series: NCS2200r
• Type: General Purposer

Specifications of NCS2201SN2T1

• Number Of Elements: 1
• Output Type: Complementary, Rail-to-Rail
• Voltage - Supply: 0.85 V ~ 6 V
• Mounting Type: Surface Mount
• Package / Case: SC-74, SOT-457
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: NCS2201SN2T1OSTR

0.05 (0.002)
0.05 (0.002)
S
S
G
G
H
H
6
L
6
1
L
1
A
5
2
A
5
2
3
4
3
4
D
D
B
C
C
B
PACKAGE DIMENSIONS
PLASTIC PACKAGE
PLASTIC PACKAGE
NCS2200 Series
(TSOP−5, SC59−5)
(TSOP−6, SC59−6)
http://onsemi.com
CASE 318G−02
K
CASE 483−02
K
SN SUFFIX
SN SUFFIX
SOT23−5
SOT23−6
ISSUE C
ISSUE K
14
J
J
M
M
NOTES:
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
DIM
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
A
B
C
D
G
H
K
M
J
L
S
DIM
A
B
C
D
G
H
K
M
J
L
S
0.013
MILLIMETERS
MIN
2.90
1.30
0.90
0.25
0.85
0.10
0.20
1.25
2.50
0.013
MILLIMETERS
0
MIN
2.90
1.30
0.90
0.25
0.85
0.10
0.20
1.25
2.50
_
0
_
0.100
MAX
3.10
1.70
1.10
0.50
1.05
0.26
0.60
1.55
3.00
10
0.100
MAX
3.10
1.70
1.10
0.50
1.05
0.26
0.60
1.55
3.00
_
10
_
0.0512
0.0354
0.0098
0.0335
0.0005
0.0040
0.0079
0.0493
0.0985
0.1142
MIN
0.0512 0.0669
0.0354 0.0433
0.0098 0.0197
0.0335 0.0413
0.0005 0.0040
0.0040 0.0102
0.0079 0.0236
0.0493 0.0610
0.0985 0.1181
0.1142 0.1220
0
INCHES
_
MIN
0
INCHES
0.1220
0.0669
0.0433
0.0197
0.0413
0.0040
0.0102
0.0236
0.0610
0.1181
_
MAX
10
_
MAX
10
_