AP16N50W Advanced Power Electronics Corp., AP16N50W Datasheet - Page 2

Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness

AP16N50W

Manufacturer Part Number
AP16N50W
Description
Advanced Power MOSFETs from APEC provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness
Manufacturer
Advanced Power Electronics Corp.
Datasheet

Specifications of AP16N50W

Vds
500V
Vgs
±30V
Rds(on) / Max(m?) Vgs@10v
400
Qg (nc)
33
Qgs (nc)
11
Qgd (nc)
9
Id(a)
16
Pd(w)
250
Configuration
Single N
Package
TO-3P
THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.
USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.
BV
R
V
g
I
I
Q
Q
Q
t
t
t
t
C
C
C
I
I
V
t
Q
Notes:
1.Pulse width limited by Max junction temperature.
2.Pulse test
3.Starting Tj=25
AP16N50W
Electrical Characteristics@T
Source-Drain Diode
DSS
GSS
d(on)
r
d(off)
f
S
SM
rr
fs
GS(th)
SD
DS(ON)
iss
oss
rss
g
gs
gd
rr
DSS
Symbol
Symbol
o
Drain-Source Breakdown Voltage
Static Drain-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-Source Leakage Current
Drain-Source Leakage Current (T
Gate-Source Leakage
Total Gate Charge
Gate-Source Charge
Gate-Drain ("Miller") Charge
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Continuous Source Current ( Body Diode )
Pulsed Source Current ( Body Diode )
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
C , V
DD
=50V, V
Parameter
Parameter
GS
=10V, L=1mH, R
2
3
2
2
j
=25
j
=125
o
C(unless otherwise specified)
G
2
o
C)
=25Ω, I
1
V
V
V
V
V
V
V
I
V
V
V
I
R
R
V
V
f=1.0MHz
V
I
I
dI/dt=100A/µs
D
D
S
S
GS
GS
DS
DS
DS
DS
GS
DS
GS
DD
GS
DS
D
G
D
=16A, V
=16A, V
=16A
=8A
=V
=25Ω
=50Ω,V
=V
=10V, I
=500V, V
=500V
=400V
=15V
=0V, I
=10V, I
=+30V, V
=10V
=200V
=0V
AS
G
GS
=0V , V
=12A.
Test Conditions
Test Conditions
, I
D
GS
GS
,
D
=1mA
D
D
V
GS
=250uA
=8A
=0V
=0V
=6.5A
GS
GS
DS
=10V
S
=0V
=1.3V
=0V
=0V
Min.
Min.
500
2
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1950 3120
Typ.
141
Typ.
630
495
55
50
33
11
40
20
10
8
9
-
-
-
-
-
-
-
-
-
+100
Max. Units
Max. Units
200
0.4
1.3
20
53
16
60
4
-
-
-
-
-
-
-
-
-
-
-
-
nC
nC
nC
uA
uA
nA
pF
pF
pF
ns
ns
ns
ns
ns
Ω
uC
V
V
S
A
A
V
2

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