74LVC1G07GW,125 NXP Semiconductors, 74LVC1G07GW,125 Datasheet - Page 2

• Manufacturer Part Number: 74LVC1G07GW,125
• Description: IC BUFF OPEN DRAIN N-INV 5TSSOP
• Manufacturer: NXP Semiconductors
• Series: 74LVCr

Specifications of 74LVC1G07GW,125

• Logic Type: Buffer/Line Driver, Non-Inverting with Open Drain
• Package / Case: SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
• Number Of Elements: 1
• Number Of Bits Per Element: 1
• Current - Output High, Low: 32mA, 32mA
• Voltage - Supply: 2 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Logic Family: 74LVC
• Number Of Channels Per Chip: 1
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: 125 C
• Mounting Style: SMD/SMT
• Input Bias Current (max): 200 uA
• Low Level Output Current: 32 mA
• Maximum Power Dissipation: 250 mW
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): 1 / 1
• Output Type: Open Drain
• Propagation Delay Time: 4.5 ns
• Logical Function: Buffer/Driver
• Number Of Elements: 1
• Number Of Channels: 1
• Number Of Inputs: 1
• Number Of Outputs: 1
• Operating Supply Voltage (typ): 1.8/2.5/3.3/5V
• Package Type: TSSOP
• High Level Output Current: 32mA
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 1.65V
• Quiescent Current: 200uA
• Technology: CMOS
• Pin Count: 5
• Mounting: Surface Mount
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-2295-2; 74LVC1G07GW-G; 935266681125

NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74LVC1G07
Product data sheet
Type number
74LVC1G07GW
74LVC1G07GV
74LVC1G07GM
74LVC1G07GF
74LVC1G07GN
74LVC1G07GS
Type number
74LVC1G07GW
74LVC1G07GV
74LVC1G07GM
74LVC1G07GF
74LVC1G07GN
74LVC1G07GS
Fig 1.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
2
Logic symbol
Ordering information
Marking
A
Package
Temperature range Name
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
−40 °C to +125 °C
mna623
Y
4
TSSOP5
SC-74A
XSON6
XSON6
XSON6
XSON6
All information provided in this document is subject to legal disclaimers.
Fig 2.
Rev. 9 — 24 August 2010
A
IEC logic symbol
2
plastic extremely thin small outline package;
plastic extremely thin small outline package;
extremely thin small outline package; no leads;
extremely thin small outline package; no leads;
Description
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
plastic surface-mounted package; 5 leads
no leads; 6 terminals; body 1 × 1.45 × 0.5 mm
no leads; 6 terminals; body 1 × 1 × 0.5 mm
6 terminals; body 0.9 × 1.0 × 0.35 mm
6 terminals; body 1.0 × 1.0 × 0.35 mm
Marking code
VS
V07
VS
VS
VS
VS
mna624
4
Y
[1]
Fig 3.
Buffer with open-drain output
A
Logic diagram
74LVC1G07
© NXP B.V. 2010. All rights reserved.
GND
Y
Version
SOT353-1
SOT753
SOT886
SOT891
SOT1115
SOT1202
mna591
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