74LVC1G125GM,115 NXP Semiconductors, 74LVC1G125GM,115 Datasheet - Page 2

• Manufacturer Part Number: 74LVC1G125GM,115
• Description: IC BUFF DVR TRI-ST N-INV 6XSON
• Manufacturer: NXP Semiconductors
• Series: 74LVCr

Specifications of 74LVC1G125GM,115

• Package / Case: 6-XSON (Micropak™), SOT-886
• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 1
• Current - Output High, Low: 32mA, 32mA
• Voltage - Supply: 2 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Logic Family: 74LVC
• Number Of Channels Per Chip: 1
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 32 mA
• Input Bias Current (max): 200 uA
• Low Level Output Current: 32 mA
• Minimum Operating Temperature: - 40 C
• Output Type: 3-State
• Propagation Delay Time: 2.1 ns
• Number Of Lines (input / Output): 1 / 1
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 568-4396-2; 74LVC1G125GM-G; 74LVC1G125GM-G; 935277203115

NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74LVC1G125
Product data sheet
Type number
74LVC1G125GW
74LVC1G125GV
74LVC1G125GM
74LVC1G125GF
74LVC1G125GN
Type number
74LVC1G125GW
74LVC1G125GV
74LVC1G125GM
74LVC1G125GF
74LVC1G125GN
74LVC1G125GS
74LVC1G125GS
Fig 1.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
2
1
Logic symbol
Ordering information
Marking
OE
A
mna118
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
Y
4
All information provided in this document is subject to legal disclaimers.
Fig 2.
TSSOP5
SC-74A
XSON6
XSON6
XSON6
XSON6
Rev. 9 — 29 December 2010
2
1
IEC logic symbol
EN
plastic thin shrink small outline package; 5 leads;
Description
body width 1.25 mm
plastic surface-mounted package; 5 leads
plastic extremely thin small outline package;
no leads; 6 terminals; body 1  1.45  0.5 mm
plastic extremely thin small outline package;
no leads; 6 terminals; body 1  1  0.5 mm
extremely thin small outline package; no leads;
6 terminals; body 0.9  1.0  0.35 mm
extremely thin small outline package; no leads;
6 terminals; body 1.0  1.0  0.35 mm
Marking code
VM
V25
VM
VM
VM
VM
mna119
4
[1]
Fig 3.
OE
A
Bus buffer/line driver; 3-state
Logic diagram
74LVC1G125
© NXP B.V. 2010. All rights reserved.
Version
SOT353-1
SOT753
SOT886
SOT891
SOT1115
SOT1202
mna120
2 of 19
Y