74HCT365DB,112 NXP Semiconductors, 74HCT365DB,112 Datasheet - Page 4

IC BUFF/DVR TRI-ST 6BIT 16SSOP

74HCT365DB,112

Manufacturer Part Number
74HCT365DB,112
Description
IC BUFF/DVR TRI-ST 6BIT 16SSOP
Manufacturer
NXP Semiconductors
Series
74HCTr

Specifications of 74HCT365DB,112

Logic Type
Buffer/Line Driver, Non-Inverting
Package / Case
16-SSOP
Number Of Elements
1
Number Of Bits Per Element
6
Current - Output High, Low
6mA, 6mA
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
74HCT
Number Of Channels Per Chip
6
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Operating Temperature
125 C
Mounting Style
SMD/SMT
High Level Output Current
- 6 mA
Input Bias Current (max)
8 uA
Low Level Output Current
6 mA
Maximum Power Dissipation
500 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
8 / 6
Output Type
3-State
Propagation Delay Time
11 ns
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-2825-5
935189900112
Philips Semiconductors
January 1996
DIP16: plastic dual in-line package; 16 leads (300 mil)
Package outline drawings
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
VERSION
OUTLINE
SOT38-4
max.
0.17
4.2
A
L
0.020
min.
0.51
A
Z
1
1
16
pin 1 index
max.
0.13
A
3.2
IEC
2
0.068
0.051
1.73
1.30
b
e
0.021
0.015
0.53
0.38
b
1
JEDEC
D
0.049
0.033
1.25
0.85
b
REFERENCES
2
0
b
0.014
0.009
0.36
0.23
c
scale
19.50
18.55
EIAJ
D
0.77
0.73
5
4
(1)
9
8
b
1
6.48
6.20
0.26
0.24
E
(1)
A
b
1
2
w
A
E
10 mm
M
2.54
0.10
2
e
A
7.62
0.30
e
1
3.60
3.05
0.14
0.12
c
L
PROJECTION
EUROPEAN
(e )
M
M
8.25
7.80
0.32
0.31
M
1
H
E
E
10.0
0.39
0.33
M
8.3
H
ISSUE DATE
0.254
0.01
92-11-17
95-01-14
w
SOT38-4
0.030
max.
0.76
Z
(1)

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