TB62747AFNG Toshiba, TB62747AFNG Datasheet - Page 6
![no-image](/images/manufacturer_photos/0/6/668/toshiba_sml.jpg)
TB62747AFNG
Manufacturer Part Number
TB62747AFNG
Description
Manufacturer
Toshiba
Datasheet
1.TB62747AFG.pdf
(20 pages)
Specifications of TB62747AFNG
Package
VSOP24
# Outputs
16
Vout Max
26V
Io
1.5 to 45mA
Io Accuracy
±1.5%
Features Error Detection
-
Features Gain Control
-
Features Pwm Dimming
-
Other Features & Functions
Available in small QSOP24 package (outside Japan)
Rohs Compatible Product(s) (#)
Available
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TB62747AFNG(O,EL)
Manufacturer:
STM
Quantity:
1 956
Absolute Maximum Rating
Operating Conditions
Power supply voltage
Output current
Logic input voltage
Output voltage
Operating temperature
Storage temperature
Thermal resistance
Power dissipation
Power supply voltage
Output voltage when OFF
High level logic input voltage
Low level logic input voltage
High level SOUT output current
Low level SOUT output current
Constant current output
Serial data transfer frequency
Hold time
Setup time
Maximum clock rise time
Maximum clock fall time
Note1: Voltage is ground referenced.
Note2: However, do not exceed 6V.
Note3: PCB condition 76.2 x 114.3 x 1.6 mm, Cu 30% (SEMI conforming)
Note4: The power dissipation decreases the reciprocal of the saturated thermal resistance (1/ Rth(j-a)) for each
DC Items (Unless otherwise specified, V
AC Items (Unless otherwise specified, V
Note1: If the device is connected in a cascade and the tr/tf of the clock waveform increases due to deceleration of the clock
waveform,it may not be possible to achieve the timing required for data transfer. Please keep these timing conditions in mind
when designing your application.
degree (1°C) that the ambient temperature is exceeded (Ta = 25°C).
Characteristics
Characteristics
Characteristics
s (T
t
t
V
Symbol
Rth(j-a)
Symbol
Symbol
t
t
SETUP1
SETUP2
HOLD1
HOLD2
P
O (ON)
f
V
T
V
T
I
V
V
V
I
I
I
SCK
V
I
OH
a
D
OL
O1
O2
opr
DD
stg
DD
t
t
O
IN
IH
O
IL
r
f
*4
= 25°C)
SIN,SCK, SLAT , OE
SIN,SCK, SLAT , OE
OUTn
OUTn , V
OUTn , V
Circuits
Test
6
6
6
6
6
6
6
DD
DD
1.32 (AFG) *3, 1.04 (AFNG) *3, 1.56(AFNAG/BFNAG)
94 (AFG) *3, 120 (AFNG) *3, 80.07(AFNAG/BFNAG)
DD
DD
6
= 3.0 to 5.5 V, T
= 3.0 to 5.5 V, T
*1
*1
= 3.3 V, V
= 5.0 V, V
TB62747AFG/AFNG/AFNAG/BFNAG
Test Conditions
Test Conditions
⎯
⎯
⎯
O
O
When mounted PCB
When mounted PCB
− 0.3 to V
= 0.4 to 1.0 V
= 0.4 to 1.2 V
⎯
⎯
⎯
⎯
⎯
− 0.4 to 6.0
− 55 to 150
− 0.3 to 26
Rating *1
− 40 to 85
a
a
55
DD
= −40°C to 85°C)
= −40°C to 85°C)
+ 0.3 *2
0.7 ×
GND
V
Min
Min
3.0
0.4
1.5
1.5
⎯
⎯
⎯
⎯
⎯
DD
5
5
5
5
Typ.
Typ.
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
2009-01-21
0.3 ×
Max
V
V
Max
500
500
5.5
4.0
− 1
35
45
25
⎯
⎯
⎯
⎯
DD
DD
1
°C/W
Unit
MHz
Unit
Unit
mA
mA
mA
mA
°C
°C
W
ns
ns
ns
ns
ns
ns
V
V
V
V
V
V
V