TB6607FLG Toshiba, TB6607FLG Datasheet - Page 13

• Manufacturer Part Number: TB6607FLG
• Manufacturer: Toshiba

Specifications of TB6607FLG

• Function: Driver
• Vopmax (vm*): 5.5V (6V)
• Io (lpeak): 0.6A (0.8A)
• Channel: 5-ch
• I/f: serial input
• Option: Const current x2
• Package: QON36
• Rohs Compatible†: yes

QON Package Considerations
Package Appearances
Guidelines:
Please follow the following guidelines for the QON package.
(1)
(2)
The solder plated pads at the four corners of the package (shaded areas in the bottom view) should not
be soldered for the purpose of improving the mechanical strength of solder joints.
When using the TB6607FLG, it should be ensured that the thermal pad and solder plated pads
(shaded areas in the top and bottom views) are electrically insulated (Note).
Note: Care should be taken in the board design to prevent solder for through-hole joints from flowing to the
•
•
When mounting or soldering this package, care must be taken to avoid electrostatic discharge or
It should be ensured that no voltage is directly applied to the solder plated pads when designing
electrical overstress to the IC. (This is to avoid electrical leakage and a buildup of electrostatic
charge in the end product.)
the PC board.
solder plated pads on the bottom of the package (shaded areas in the bottom view).
(Top view)
13
(Bottom view)
TB6607FLG
2008-01-15