TMP87xy53FG Toshiba, TMP87xy53FG Datasheet - Page 3

• Manufacturer Part Number: TMP87xy53FG
• Manufacturer: Toshiba

Specifications of TMP87xy53FG

• Package: QFP80
• Rom Types (m=mask,p=otp,f=flash): M/F
• Rom Size: 32
• Ram Size: 1K
• Driver Led: 7
• Driver Lcd: -
• Spi/sio Channels: 1
• Uart/sio Channels: 1
• I2c/sio Channels: -
• High-speed Serial Output: -
• Adc 8-bit Channels: 8
• Adc 10-bit Channels: -
• Da Converter Channels: -
• Timer Counter 18-bit Channel: -
• Timer Counter 16-bit Channel: 2
• Timer Counter 8-bit Channel: 2
• Motor Channels: -
• Watchdog Timer: Y
• Dual Clock: Y
• Clock Gear: Y
• Number Of I/o Ports: 72
• Power Supply (v): 4.5 to 5.5

RESTRICTIONS ON PRODUCT USE
Previous Part Number
• The information contained herein is subject to change without notice.
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
• The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer,
• The products described in this document shall not be used or embedded to any downstream products of which
• The information contained herein is presented only as a guide for the applications of our products. No responsibility
• Please contact your sales representative for product-by-product details in this document regarding RoHS
• For a discussion of how the reliability of microcontrollers can be predicted, please refer to Section 1.3 of the chapter
1. Part number
2. Package code and dimensions
3. Addition of notes on lead solderability
4. RESTRICTIONS ON PRODUCT USE
5. Publication date of the datasheet
Lead solderability of Pb-free devices (with the G suffix)
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety
in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such
TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc.
personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These
TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high
quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury
(“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical
instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall
be made at the customer’s own risk.
manufacture, use and/or sale are prohibited under any applicable laws and regulations.
is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its
use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third
parties.
compatibility. Please use these products in this document in compliance with all applicable laws and regulations that
regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring
as a result of noncompliance with applicable laws and regulations.
entitled Quality and Reliability Assurance/Handling Precautions.
(in Body Text)
*
TMP87PM53F
: For the dimensions of the new package, see the attached Package Dimensions diagram.
Solderability
The following solderability test is conducted on the new device.
The following replaces the “RESTRICTIONS ON PRODUCT USE” on page 1 of body text.
The publication date of this datasheet is printed at the lower right corner of this notification.
Test
(1) Use of Lead (Pb)
(2) Use of Lead (Pb)-Free
Previous Package Code
·use of R-type flux
·solder bath temperature = 245°C
·dipping time = 5 seconds
·the number of times = once
·use of R-type flux
·solder bath temperature = 230°C
·dipping time = 5 seconds
·the number of times = once
QFP80-P-1420-0.80B
(in Body Text)
Test Conditions
New Part Number
II
TMP87PM53FG
Leads with over 95% solder coverage
New Package Code
QFP80-P-1420-0.80B
till lead forming are acceptable.
Remark
TMP87PM53
2008-03-06
OTP
20070701-EN
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