DNA30E2200FE IXYS, DNA30E2200FE Datasheet
DNA30E2200FE
Specifications of DNA30E2200FE
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DNA30E2200FE Summary of contents
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... FSM I²t value for fusing C junction capacitance J IXYS reserves the right to change limits, conditions and dimensions. © 2011 IXYS all rights reserved 5 1 Applications: ● Diode for main rectification ● For single and three phase bridge configurations ...
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... IXYS reserves the right to change limits, conditions and dimensions. © 2011 IXYS all rights reserved Conditions per terminal second minute terminal to terminal terminal to backside Marking on Product DNA30E2200FE Similar Part Package DNA30E2200PA TO-220AC (2) DNA30E2200PC TO-263AB (D2Pak) DNA30EM2200PC TO-263AB (D2Pak) Data according to IEC 60747and per diode unless otherwise specified ...
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... Outlines i4-Pac IXYS reserves the right to change limits, conditions and dimensions. © 2011 IXYS all rights reserved Data according to IEC 60747and per diode unless otherwise specified DNA 30 E 2200 FE Millimeter Inches Dim. min max min A 4.83 5.21 0.190 A1 2.59 3.00 0.102 A2 1 ...
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... Fig. 4 Power dissipation vs. direct output current & ambient temperature, sine 180° 1.4 1.2 1.0 Z thJC 0.8 [K/W] 0.6 0.4 0.2 0.0 0.001 0.01 Fig. 6 Transient thermal impedance junction to case IXYS reserves the right to change limits, conditions and dimensions. © 2011 IXYS all rights reserved 400 300 I FSM 200 [A] 100 0 2.5 0.001 0.01 0.1 t [s] Fig ...