VND5050AKE STMICRO, VND5050AKE Datasheet - Page 24

• Manufacturer Part Number: VND5050AKE
• Manufacturer: STMICRO

Package and PCB thermal data
4
4.1
Note:
24/37
Package and PCB thermal data
PowerSSO-12™ thermal data
Figure 28. PowerSSO-12™ PC board
Layout condition of R
area= 77 mm x 86 mm,PCB thickness=1.6 mm, Cu thickness=70 μm (front and back side),
Copper areas: from minimum pad lay-out to 8 cm
Figure 29. R
RTHj _amb( ° C/ W)
70
65
60
55
50
45
40
35
30
0
on)
thj-amb
th
vs PCB copper area in open box free air condition (one channel
and Z
2
th
Doc ID 12272 Rev 9
measurements (PCB: Double layer, Thermal Vias, FR4
PCB Cu heat sink area ( cm^ 2)
4
2
).
6
VND5050AJ-E / VND5050AK-E
8
10