VND5050AKE STMICRO, VND5050AKE Datasheet - Page 27

• Manufacturer Part Number: VND5050AKE
• Manufacturer: STMICRO

VND5050AJ-E / VND5050AK-E
4.2
Note:
PowerSSO-24™ thermal data
Figure 32. PowerSSO-24™ PC board
Layout condition of R
area= 77 mm x 86 mm, PCB thickness=1.6mm, Cu thickness=70 µm (front and back side),
Copper areas: from minimum pad lay-out to 8 cm
Figure 33. R
RTHj_amb(°C/W)
55
50
45
40
35
30
0
on)
thj-amb
th
vs PCB copper area in open box free air condition (one channel
and Z
2
th
Doc ID 12272 Rev 9
measurements (PCB: Double layer, Thermal Vias, FR4
PCB Cu heatsink area (cm^2)
4
2
).
6
Package and PCB thermal data
8
10
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