T-M3.2 Infineon Technologies, T-M3.2 Datasheet
T-M3.2
Specifications of T-M3.2
Related parts for T-M3.2
T-M3.2 Summary of contents
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... T-M3.2 Wire Bond Globe Top Package For contact based application (Memory Pro May 2010 & ...
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... T-M3.2 Short Product Overview Revision History: Current Version 05.10 Previous Releases: Page Further information is confidential and on request. Please contact: Important: Infineon Technologies AG in Munich, Germany, Chip Card & Security ICs, E-Mail: security.chipcard.ics@infineon.com Edition 2010 Published by Infineon Technologies AG, Chip Card & Security 81726 Munich, Germany © ...
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... Thickness max. 580µm Contact Surface CIN Delivery form Tape on Reel Reel diameter 330mm ISO - reference ISO/IEC 7810 SO/IEC 7816-1 ISO/IEC 10373 Derivatives Information For further information on technology, delivery forms and conditions please contact your nearest Infineon Technologies sales representative (www.infineon.com). T-M3.2 T-M3.2 ...
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... Published by Infineon Technologies AG ...