BC860B Infineon Technologies, BC860B Datasheet
BC860B
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BC860B Summary of contents
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PNP Silicon AF Transistor For AF input stages and driver applications High current gain Low collector-emitter saturation voltage Low noise between 30 hz and 15 kHz Complementary types: BC846...-BC850... (NPN) Pb-free (RoHS compliant) package Qualified according AEC Q101 1 Pb-containing ...
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... Type BC856A BC856B BC856BW BC857A BC857B BC857BF BC857BL3 BC857BW BC857C BC857CW BC858A BC858B BC858BL3 BC858BW BC858C BC858CW BC859B BC859C BC860B BC860BW BC860CW Marking Pin Configuration 3As 1=B 2=E 3=C 3Bs 1=B 2=E 3=C 3Bs 1=B 2=E 3=C 3Es 1=B 2=E 3=C 3Fs 1=B 2=E 3=C 3Fs 1=B 2=E 3=C 3F 1=B 2=E 3=C 3Fs 1=B 2=E 3=C 3Gs 1=B 2=E 3=C 3Gs 1=B 2=E 3=C 3Js 1=B 2=E 3=C 3Ks 1=B 2=E 3=C 3K 1=B 2=E 3=C 3Ks 1=B 2=E 3=C 3Ls 1=B 2=E 3=C 3Ls 1=B 2=E 3=C 4Bs 1=B 2=E 3=C 4Cs ...
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... BC857..., BC860... BC858..., BC859... Emitter-base voltage Collector current Peak collector current Total power dissipation T 71 °C, BC856-BC860 S T 128 °C, BC857BF-BC858BF S T 135 °C, BC857BL3, BC860BL3 S T 124 °C, BC856W-BC860W S Junction temperature Storage temperature Thermal Resistance Parameter 1) Junction - soldering point BC856-BC860 BC857BF-BC858BF ...
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Electrical Characteristics at T Parameter DC Characteristics Collector-emitter breakdown voltage mA BC856... mA BC857..., BC860... mA ...
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Electrical Characteristics at T Parameter AC Characteristics Transition frequency mA 100 MHz C CE Collector-base capacitance MHz CB Emitter-base capacitance V = 0.5 V, ...
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DC current gain 100 - Base-emitter ...
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Transition frequency MHz Total power dissipation P BC856-BC860 360 mW 300 270 240 210 180 150 ...
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Total power dissipation P BC857BL3, BC858BL3 300 mW 250 225 200 175 150 125 100 Permissible Pulse Load totmax totDC p BC856/W-BC860 ...
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Permissible Pulse Load totmax totDC p BC857BF, BC858BF D=0 10 0.005 0.01 0.02 0.05 0.1 0.2 0 Permissible Pulse Load ...
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Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package SOT23 2.9 ±0 +0.1 0.4 -0.05 C 0.95 1.9 0.25 B ...
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Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Package SOT323 2 ±0.2 0.1 MAX. +0.1 3x 0.3 -0.05 0 0.65 0.65 0.2 0.6 ...
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Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel Pin 1 Package TSFP-3 1.2 ±0.05 0.2 0.55 ±0.05 ±0. 0.2 0.15 ±0.05 0.4 ±0.05 0.4 ...
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Package Outline Top view Pin 1 marking 1) Dimension applies to plated terminal Foot Print For board assembly information please refer to Infineon website "Packages" 0.225 0.15 Copper Marking Layout (Example) Standard Packing Reel ø180 mm = ...
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... For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies failure of such components can reasonably be expected to cause the failure of that life-support device or system affect the safety or effectiveness of that device or system ...