IFX 25001TF V33 Infineon Technologies, IFX 25001TF V33 Datasheet - Page 6

• Manufacturer Part Number: IFX 25001TF V33
• Manufacturer: Infineon Technologies

Specifications of IFX 25001TF V33

• Packages: PG-TO252-3
• Automotive Qualified: no
• Regulator Type: single output
• Output Voltage: 3.3V
• Accuracy: 4.0 %
• Max. Output Current: 400mA

4.3
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
Pos.
4.3.1
4.3.2
4.3.3
4.3.4
PG-TO263-3
4.3.5
4.3.6
4.3.7
4.3.8
PG-TO220-3
4.3.9
PG-SOT223-4
4.3.10
4.3.11
4.3.12
4.3.13
1) Not subject to production test, specified by design.
2) Specified
3) Specified
Data Sheet
PG-TO252-3
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm
to www.jedec.org.
Parameter
Junction to Case
Junction to Ambient
Junction to Case
Junction to Ambient
Junction to Case
Junction to Case
Junction to Ambient
R
R
Thermal Resistance
thJA
thJA
value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
value is according to Jedec JESD 51-3 at natural convection on FR4 1s0p board; The Product
1)
1)
1)
1)
1)
1)
1)
Symbol
R
R
R
R
R
R
R
R
R
R
R
R
R
thJC
thJA
thJA
thJA
thJC
thJA
thJA
thJA
thJC
thJC
thJA
thJA
thJA
6
Min.
–
–
–
–
–
–
–
–
–
–
–
–
–
3
board with 1 copper layer (1 x 70µm Cu).
Limit Values
Typ.
4
27
57
42
4
22
42
33
8
25
51
75
63
Max.
–
–
–
–
–
–
–
–
–
–
–
–
–
General Product Characteristics
Unit
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
K/W
Rev. 1.02, 2010-05-20
Conditions
measured to heat
slug
2)
300 mm² heatsink
area
600 mm² heatsink
area
measured to heat
slug
2)
300 mm² heatsink
area
600 mm² heatsink
area
measured to
exposed pad
measured to heat
slug
2)
300 mm² heatsink
area
600 mm² heatsink
area
3)
3)
3)
3)
3)
3)
IFX25001