BGM1034N7 Infineon Technologies, BGM1034N7 Datasheet - Page 3

• Manufacturer Part Number: BGM1034N7
• Manufacturer: Infineon Technologies

Specifications of BGM1034N7

• Packages: TSNP-7-10
• I (typ): 3.9 mA
• Gain (typ): 17.0 dB
• Nfmin (typ): 1.7 dB
• P-1db (in): -15 dBm
• Frequency (f): 1550 – 1615 MHz

BGM1034N7 GPS and GLONASS Front-End Module
Revision History: 2011-07-18, Revision 3.0
Previous Revision: 2011-05-10, Preliminary V2.0
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Trademarks of Infineon Technologies AG
AURIX™,
CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPIM™,
EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™,
ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™, PRIMARION™, PrimePACK™, PrimeSTACK™,
PRO-SIL™,
SmartLEWIS™, SOLID FLASH™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. Mifare™ of NXP. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™
of MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc.,
OmniVision™ of OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc.
RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.
SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden
Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA.
UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™
of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of
Diodes Zetex Limited.
Last Trademarks Update 2011-02-24
Data Sheet
Subjects (major changes since last revision)
Package drawing updated
Marking defined
Maximum voltage at Pin AI to GND changed
Maximum value of ESD contact discharge capability of RF Input pin changed
ESD capability HBM for pins 3 and 4 added
Updated value for Out-of-band 3rd Order Intercept Point
Parts list changed (description for inductor L1)
Pin description for pin 7 changed
Cross-section view updated
Updated carrier tape drawing
C166™,
PROFET™,
CanPAK™,
RASIC™,
CIPOS™,
ReverSave™,
CIPURSE™,
3
SatRIC™,
GPS and GLONASS Front-End Module
EconoPACK™,
SIEGET™,
SINDRION™,
CoolMOS™,
Revision 3.0, 2011-07-18
BGM1034N7
CoolSET™,
SIPMOS™,