74HCT241DB,112 NXP Semiconductors, 74HCT241DB,112 Datasheet - Page 3

IC BUFF/DVR TRI-ST DUAL 20SSOP

74HCT241DB,112

Manufacturer Part Number
74HCT241DB,112
Description
IC BUFF/DVR TRI-ST DUAL 20SSOP
Manufacturer
NXP Semiconductors
Series
74HCTr

Specifications of 74HCT241DB,112

Package / Case
20-SSOP
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
4
Current - Output High, Low
6mA, 6mA
Voltage - Supply
4.5 V ~ 5.5 V
Mounting Type
Surface Mount
Logic Family
74HCT
Number Of Channels Per Chip
8
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 6 mA
Input Bias Current (max)
8 uA
Low Level Output Current
6 mA
Minimum Operating Temperature
- 40 C
Output Type
3-State
Propagation Delay Time
11 ns
Number Of Lines (input / Output)
8 / 8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Operating Temperature
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-2808-5
935182590112
Philips Semiconductors
DIP
DIP14: plastic dual in-line package; 14 leads (300 mil)
January 1996
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Package outline drawings
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
inches
UNIT
mm
OUTLINE
VERSION
SOT27-1
max.
0.17
4.2
A
L
0.020
min.
0.51
A
Z
1
14
pin 1 index
1
050G04
IEC
max.
0.13
3.2
A
2
e
0.068
0.044
1.73
1.13
b
MO-001AA
0.021
0.015
0.53
0.38
JEDEC
b
D
1
REFERENCES
0
0.014
0.009
0.36
0.23
b
c
19.50
18.55
0.77
0.73
D
(1)
scale
EIAJ
5
3
b
8
7
1
6.48
6.20
0.26
0.24
E
(1)
A
w
1
M
2.54
0.10
e
A
E
10 mm
2
A
7.62
0.30
e
1
3.60
3.05
0.14
0.12
L
c
PROJECTION
EUROPEAN
8.25
7.80
0.32
0.31
M
(e )
M
M
E
H
1
E
10.0
0.39
0.33
M
8.3
H
ISSUE DATE
0.254
0.01
92-11-17
95-03-11
w
SOT27-1
0.087
max.
2.2
Z
(1)

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