74HC541N,652 NXP Semiconductors, 74HC541N,652 Datasheet - Page 5

IC BUFF/DVR TRI-ST 8BIT 20DIP

74HC541N,652

Manufacturer Part Number
74HC541N,652
Description
IC BUFF/DVR TRI-ST 8BIT 20DIP
Manufacturer
NXP Semiconductors
Series
74HCr
Datasheet

Specifications of 74HC541N,652

Logic Type
Buffer/Line Driver, Non-Inverting
Package / Case
20-DIP (0.300", 7.62mm)
Number Of Elements
1
Number Of Bits Per Element
8
Current - Output High, Low
7.8mA, 7.8mA
Voltage - Supply
2 V ~ 6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Through Hole
Logic Family
74HC
Number Of Channels Per Chip
8
Polarity
Non-Inverting
Supply Voltage (max)
6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
125 C
Mounting Style
Through Hole
High Level Output Current
- 7.8 mA
Input Bias Current (max)
8 uA
Low Level Output Current
7.8 mA
Maximum Power Dissipation
750 mW
Minimum Operating Temperature
- 40 C
Output Type
3-State
Propagation Delay Time
35 ns
Number Of Lines (input / Output)
8 / 8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1475-5
74HC541N
933670660652
Philips Semiconductors
DC CHARACTERISTICS FOR 74HC
For the DC characteristics see
Output capability: bus driver
I
AC CHARACTERISTICS FOR 74HC
GND = 0 V; t
December 1990
CC
SYMBOL PARAMETER
t
t
t
t
PHL
PZH
PHZ
THL
Octal buffer/line driver; 3-state
category: MSI
/ t
/ t
/ t
/ t
TLH
PLH
PZL
PLZ
propagation delay
3-state output
enable time
3-state output
disable time
r
output transition time
A
OE to Y
OE to Y
= t
n
f
to Y
= 6 ns; C
n
n
n
L
= 50 pF
“74HC/HCT/HCU/HCMOS Logic Family Specifications”
min. typ. max. min. max. min. max.
33
12
10
55
20
16
61
22
18
14
5
4
25
115
23
20
160
32
27
160
32
27
60
12
10
T
5
amb
74HC
40 to 85
( C)
145
29
25
200
40
34
200
40
34
75
15
13
40 to 125
175
35
30
240
48
41
240
48
41
90
18
15
.
ns
ns
ns
ns
UNIT
74HC/HCT541
V
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
2.0
4.5
6.0
(V)
TEST CONDITIONS
CC
Product specification
WAVEFORMS
Fig.6
Fig.7
Fig.7
Fig.6

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