74ABT162244DL,118 NXP Semiconductors, 74ABT162244DL,118 Datasheet

IC BUFF DVR TRI-ST 16BIT 48SSOP

74ABT162244DL,118

Manufacturer Part Number
74ABT162244DL,118
Description
IC BUFF DVR TRI-ST 16BIT 48SSOP
Manufacturer
NXP Semiconductors
Series
74ABTr
Datasheet

Specifications of 74ABT162244DL,118

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
4
Number Of Bits Per Element
4
Current - Output High, Low
32mA, 12mA
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
48-SSOP
Logic Family
ABT
Number Of Channels Per Chip
16
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
High Level Output Current
- 32 mA
Low Level Output Current
12 mA
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
16 / 16
Output Type
3-State
Propagation Delay Time
4 ns at 5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
74ABT162244DL-T
74ABT162244DL-T
935203810118
1. General description
2. Features and benefits
3. Ordering information
Table 1.
Type number
74ABT162244DGG
74ABT162244DL
Ordering information
Package
Temperature range Name
−40 °C to +85 °C
−40 °C to +85 °C
The 74ABT162244 high-performance Bipolar CMOS (BiCMOS) device combines low
static and dynamic power dissipation with high speed and high output drive.
The 74ABT162244 is a 16-bit buffer that is ideal for driving bus lines. The device features
four output enable inputs (1OE, 2OE, 3OE, 4OE), each controlling four of the 3-state
outputs.
The 74ABT162244 is designed with 30 Ω series resistance in both the upper and lower
output structures. This design reduces line noise in applications such as memory address
drivers, clock drivers and bus receivers/transmitters.
74ABT162244
16-bit buffer/line driver with 30 Ω series termination resistors;
3-state
Rev. 05 — 25 May 2010
16-bit bus interface
Multiple V
Power-up 3-state
3-state buffers
Output capability: +12 mA and −32 mA
Live insertion and extraction permitted
Latch-up performance: JESD 78 Class II
ESD protection:
HBM JESD-A114E exceeds 2000 V
CDM JESD 22-C101-C exceeds 1000 V
CC
and GND pins minimize switching noise
TSSOP48
SSOP48
Description
plastic thin shrink small outline package; 48 leads;
body width 6.1 mm
plastic shrink small outline package; 48 leads; body
width 7.5 mm
Product data sheet
Version
SOT362-1
SOT370-1

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74ABT162244DL,118 Summary of contents

Page 1

Rev. 05 — 25 May 2010 1. General description The 74ABT162244 high-performance Bipolar CMOS (BiCMOS) device combines low static and dynamic power dissipation with high speed and high output ...

Page 2

... NXP Semiconductors 4. Functional diagram 2 47 1A0 3A0 1Y0 46 3 1A1 3A1 1Y1 44 5 1A2 3A2 1Y2 6 43 1A3 3A3 1Y3 1 1OE 3OE 8 41 2A0 4A0 2Y0 40 9 2A1 4A1 2Y1 38 11 2A2 4A2 2Y2 12 37 2A3 4A3 2Y3 48 2OE 4OE Fig 1. ...

Page 3

... NXP Semiconductors 5. Pinning information 5.1 Pinning Fig 4. Pin configuration 5.2 Pin description Table 2. Pin description Symbol Pin 1OE 1 1Y[0: GND 2Y[0: 11, 12 GND 10 3Y[0:3] 13, 14, 16 data output 0 to output 3 GND 4Y[0:3] 19, 20, 22 data output 0 to output 3 GND 21 4OE 24 74ABT162244 Product data sheet 16-bit buffer/line driver with 30 Ω ...

Page 4

... NXP Semiconductors Table 2. Pin description …continued Symbol Pin 3OE 25 GND 28 4A[0:3] 30, 29, 27 data input 0 to input GND 34 3A[0:3] 36, 35, 33 data input 0 to input 3 GND 39 2A[0:3] 41, 40, 38 data input 0 to input GND 45 1A[0:3] 47, 46, 44 data input 0 to input 3 2OE 48 74ABT162244 Product data sheet 16-bit buffer/line driver with 30 Ω ...

Page 5

... NXP Semiconductors 6. Functional description [1] Table 3. Function table Control nOE [ HIGH voltage level LOW voltage level don t care high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC V input voltage I V output voltage ...

Page 6

... NXP Semiconductors 9. Static characteristics Table 6. Static characteristics Symbol Parameter V input clamping voltage HIGH-level output OH voltage V LOW-level output OL voltage I input leakage current I I power-off leakage OFF current I power-up/power-down O(pu/pd) output current I OFF-state output OZ current I output leakage current HIGH-state output current O I supply current CC Δ ...

Page 7

... NXP Semiconductors 10. Dynamic characteristics Table 7. Dynamic characteristics GND = 0 V. For test circuit, see Figure Symbol Parameter Conditions t LOW to HIGH nAn to nYn, see PLH propagation delay t HIGH to LOW nAn to nYn, see PHL propagation delay t OFF-state to HIGH nOE to nYn; see PZH propagation delay ...

Page 8

... NXP Semiconductors 11. Waveforms input nAn output nYn and V are typical voltage output levels that occur with the output load Fig 5. Input (nAn) to output (nYn) propagation delay nOE input nYn output nYn output and V are typical voltage output levels that occur with the output load. ...

Page 9

... NXP Semiconductors 12. Test information Input pulse definition Test data is given in Table Definitions test circuit Load resistance Load capacitance including jig and probe capacitance Termination resistance should be equal to output impedance Test circuit for 3-state outputs Fig 7. Load circuitry for switching times Table 8 ...

Page 10

... NXP Semiconductors 13. Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6 pin 1 index 1 DIMENSIONS (mm are the original dimensions). A UNIT max. 0.15 1.05 mm 1.2 0.25 0.05 0.85 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. ...

Page 11

... NXP Semiconductors SSOP48: plastic shrink small outline package; 48 leads; body width 7 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.4 2.35 mm 2.8 0.25 0.2 2.20 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION IEC SOT370-1 Fig 9 ...

Page 12

... Modifications: Table 74ABT162244_4 20090409 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • 74ABTH162244 removed 74ABT_H162244_3 19981022 74ABT_H162244_2 ...

Page 13

... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...

Page 14

... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 17. Contact information For more information, please visit: For sales office addresses, please send an email to: 74ABT162244 Product data sheet 16-bit buffer/line driver with 30 Ω ...

Page 15

... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Functional description . . . . . . . . . . . . . . . . . . . 5 7 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 13 Package outline ...

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