74LVC1G17GV,125 NXP Semiconductors, 74LVC1G17GV,125 Datasheet
74LVC1G17GV,125
Specifications of 74LVC1G17GV,125
74LVC1G17GV-G
935270081125
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74LVC1G17GV,125 Summary of contents
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Single Schmitt trigger buffer Rev. 7 — 10 November 2010 1. General description The 74LVC1G17 provides a buffer function with Schmitt trigger action capable of transforming slowly changing input signals into sharply defined outputs. The input can ...
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... NXP Semiconductors 3. Ordering information Table 1. Ordering information Type number Package Temperature range −40 °C to +125 °C 74LVC1G17GW −40 °C to +125 °C 74LVC1G17GV −40 °C to +125 °C 74LVC1G17GM −40 °C to +125 °C 74LVC1G17GF −40 °C to +125 °C 74LVC1G17GN −40 °C to +125 °C 74LVC1G17GS 4 ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning 74LVC1G17 GND 001aaf190 Fig 4. Pin configuration SOT353-1 and SOT753 6.2 Pin description Table 3. Pin description Symbol Pin SOT353-1, SOT753 n. GND Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level 74LVC1G17 Product data sheet 74LVC1G17 n ...
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... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC I input clamping current IK V input voltage I I output clamping current OK V output voltage O I output current ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter V LOW-level output voltage input leakage current I I power-off leakage current V OFF I supply current CC ΔI additional supply current CC C input capacitance I = −40 °C to +125 °C T amb ...
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... NXP Semiconductors Table 8. Transfer characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions V positive-going see T+ threshold voltage negative-going see T− threshold voltage hysteresis see H voltage Figure [1] All typical values are measured at T 10.1 Transfer characteristic waveforms T− ...
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... NXP Semiconductors Fig 9. Typical transfer characteristics 11. Dynamic characteristics Table 9. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Symbol Parameter t propagation delay pd C power dissipation PD capacitance [1] Typical values are measured the same as t and PLH PHL ...
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... NXP Semiconductors 12. Waveforms Measurement points are given in V and V are typical output voltage levels that occur with the output load Fig 10. The input A to output Y propagation delay times Table 10. Measurement points Supply voltage 1. 2.7 V 2 3 5.5 V ...
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... NXP Semiconductors Table 11. Test data Supply voltage Input 2.7 V 2 3.6 V 2 13. Application information Linear change of V between 0 2 (1) Positive-going edge. (2) Negative-going edge. Fig 12. Average supply current as a function of supply voltage 74LVC1G17 Product data sheet Load ...
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... NXP Semiconductors 14. Package outline TSSOP5: plastic thin shrink small outline package; 5 leads; body width 1. DIMENSIONS (mm are the original dimensions UNIT max. 0.1 1.0 mm 1.1 0.15 0 0.8 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION IEC SOT353-1 Fig 13 ...
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... NXP Semiconductors Plastic surface-mounted package; 5 leads DIMENSIONS (mm are the original dimensions) UNIT 0.100 1.1 0.40 0.26 mm 0.013 0.9 0.25 0.10 OUTLINE VERSION IEC SOT753 Fig 14. Package outline SOT753 (SC-74A) 74LVC1G17 Product data sheet scale 3.1 1.7 3.0 0.6 0.95 2.7 1.3 2 ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1. 6× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 1.5 mm 0.5 0.04 0.17 1.4 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 0 6× (1) terminal 1 index area DIMENSIONS (mm are the original dimensions UNIT b D max max 0.20 1.05 mm 0.5 0.04 0.12 0.95 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION IEC SOT891 Fig 16 ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 0.95 mm nom 0.15 0.90 min 0.12 0.85 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.05 mm nom 0.15 1.00 min 0.12 0.95 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
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... NXP Semiconductors 15. Abbreviations Table 12. Abbreviations Acronym Description CMOS Complementary Metal Oxide Semiconductor DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 16. Revision history Table 13. Revision history Document ID Release date 74LVC1G17 v.7 20101110 • Modifications: Added type number 74LVC1G17GN (SOT1115 / XSON6 package). • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 18. Contact information For more information, please visit: For sales office addresses, please send an email to: 74LVC1G17 Product data sheet 17 ...
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... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics 10.1 Transfer characteristic waveforms . . . . . . . . . . 6 11 Dynamic characteristics ...