74AHCT2G125DP,125 NXP Semiconductors, 74AHCT2G125DP,125 Datasheet
74AHCT2G125DP,125
Specifications of 74AHCT2G125DP,125
74AHCT2G125DP-G
935274675125
Related parts for 74AHCT2G125DP,125
74AHCT2G125DP,125 Summary of contents
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Dual buffer/line driver; 3-state Rev. 02 — 22 December 2008 1. General description The 74AHC2G125 and 74AHCT2G125 are high-speed Si-gate CMOS devices. They provide a dual non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by ...
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... NXP Semiconductors 4. Marking Table 2. Marking codes Type number 74AHC2G125DP 74AHCT2G125DP 74AHC2G125DC 74AHCT2G125DC 74AHC2G125GD 74AHCT2G125GD 5. Functional diagram 1OE 2OE mce185 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning 74AHC2G125 74AHCT2G125 1 1OE GND 4 001aaj260 Fig 4. Pin configuration SOT505-2 (TSSOP8) and SOT765-1 (VSSOP8) 74AHC_AHCT2G125_2 Product data sheet 74AHC2G125 ...
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... NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol Pin 1OE, 2OE GND 4 1Y Functional description [1] Table 4. Function table Control nOE [ HIGH voltage level LOW voltage level don’t care high-impedance OFF-state. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors 9. Recommended operating conditions Table 6. Recommended operating conditions Voltages are referenced to GND (ground = 0 V). Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb t/ V input transition rise and fall rate 10. Static characteristics Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V) ...
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... NXP Semiconductors Table 7. Static characteristics Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions C input I capacitance 74AHCT2G125 V HIGH-level input voltage V LOW-level input voltage V HIGH-level output voltage 8 LOW-level output voltage 8 OFF-state output current input leakage GND current 5.5 V ...
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... NXP Semiconductors Table 8. Dynamic characteristics GND = 0 V; for test circuit see Figure Symbol Parameter Conditions t enable time nOE to nY; see disable time nOE to nY; see dis power per buffer; PD dissipation pF capacitance V = GND 74AHCT2G125 t propagation nA to nY; see pd delay ...
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... NXP Semiconductors Table 8. Dynamic characteristics GND = 0 V; for test circuit see Figure Symbol Parameter Conditions C power per buffer; PD dissipation pF capacitance V = GND [ the same as t and PLH PHL t is the same as t and PZL PZH t is the same as t and t . dis PLZ ...
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... NXP Semiconductors nOE input output LOW-to-OFF OFF-to-LOW output HIGH-to-OFF OFF-to-HIGH Measurement points are given in Logic levels: V and Fig 7. Enable and disable times Table 9. Measurement points Type Input V M 74AHC2G125 0.5V 74AHCT2G125 1.5 V 74AHC_AHCT2G125_2 Product data sheet 74AHC2G125; 74AHCT2G125 GND t PLZ V CC ...
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... NXP Semiconductors negative positive Test data is given in Table Definitions test circuit Termination resistance should be equal to output impedance Load capacitance including jig and probe capacitance Load resistance Test selection switch. Fig 8. Test circuit for measuring switching times Table 10. Test data Type Input ...
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... NXP Semiconductors 13. Package outline TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0.95 mm 1.1 0.25 0.00 0.75 Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. ...
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... NXP Semiconductors VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2 pin 1 index 1 e DIMENSIONS (mm are the original dimensions UNIT max. 0.15 0. 0.12 0.00 0.60 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. ...
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... NXP Semiconductors XSON8U: plastic extremely thin small outline package; no leads; 8 terminals; UTLP based; body 0.5 mm terminal 1 index area DIMENSIONS (mm are the original dimensions) A UNIT max 0.05 0.35 2.1 mm 0.5 0.00 0.15 1.9 OUTLINE VERSION IEC SOT996 Fig 11. Package outline SOT996-2 (XSON8U) ...
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... Product data sheet • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Added type number 74AHC2G125GD and 74AHCT2G125GD (XSON8U package). ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 14 Abbreviations ...