74LVC162244ADGG,11 NXP Semiconductors, 74LVC162244ADGG,11 Datasheet - Page 13

IC BUFF DVR TRI-ST 16BIT 48TSSOP

74LVC162244ADGG,11

Manufacturer Part Number
74LVC162244ADGG,11
Description
IC BUFF DVR TRI-ST 16BIT 48TSSOP
Manufacturer
NXP Semiconductors
Series
74LVCr
Datasheet

Specifications of 74LVC162244ADGG,11

Logic Type
Buffer/Line Driver, Non-Inverting
Package / Case
48-TSSOP
Number Of Elements
4
Number Of Bits Per Element
4
Current - Output High, Low
12mA, 12mA
Voltage - Supply
1.2 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Logic Family
LVC
Number Of Channels Per Chip
16
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
1.2 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 12 mA
Input Bias Current (max)
80 uA
Low Level Output Current
12 mA
Minimum Operating Temperature
- 40 C
Output Type
3-State
Propagation Delay Time
11 ns (Typ) @ 1.2 V
Number Of Lines (input / Output)
16 / 16
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
74LVC162244ADG
74LVC162244ADG
74LVC162244ADGG,51
Philips Semiconductors
PACKAGE OUTLINES
2003 Dec 12
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm
16-bit buffer/line driver, 30
resistors; 5 V tolerant input/output; 3-state
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT370-1
48
max.
1
2.8
Z
A
y
0.4
0.2
A
1
pin 1 index
2.35
2.20
A
2
IEC
e
0.25
A
3
D
0.3
0.2
b
p
0.22
0.13
MO-118
JEDEC
c
0
series termination
16.00
15.75
REFERENCES
D
(1)
E
7.6
7.4
b
(1)
p
JEITA
25
24
scale
0.635
13
5
e
w
M
10.4
10.1
H
c
E
1.4
L
A
10 mm
2
A
1.0
0.6
L
1
p
1.2
1.0
Q
H
E
E
detail X
PROJECTION
EUROPEAN
0.25
v
L
L
74LVCH162244A
Q
p
74LVC162244A;
0.18
w
(A )
3
Product specification
A
0.1
y
A
ISSUE DATE
99-12-27
03-02-19
X
0.85
0.40
Z
v
(1)
M
SOT370-1
A
8
0
o
o

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