74AUP1G17GF,132 NXP Semiconductors, 74AUP1G17GF,132 Datasheet - Page 2

IC BUFF SCHMT TRIG LOW PWR 6XSON

74AUP1G17GF,132

Manufacturer Part Number
74AUP1G17GF,132
Description
IC BUFF SCHMT TRIG LOW PWR 6XSON
Manufacturer
NXP Semiconductors
Series
74AUPr
Datasheet

Specifications of 74AUP1G17GF,132

Logic Type
Schmitt Trigger - Buffer, Driver
Number Of Elements
1
Number Of Bits Per Element
1
Current - Output High, Low
4mA, 4mA
Voltage - Supply
0.8 V ~ 3.6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
6-XSON, SOT891
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
74AUP1G17GF-H
74AUP1G17GF-H
935281112132
NXP Semiconductors
3. Ordering information
Table 1.
4. Marking
Table 2.
[1]
5. Functional diagram
74AUP1G17
Product data sheet
Type number
74AUP1G17GW
74AUP1G17GM
74AUP1G17GF
Type number
74AUP1G17GW
74AUP1G17GM
74AUP1G17GF
74AUP1G17GN
74AUP1G17GS
74AUP1G17GN
74AUP1G17GS
Fig 1.
Fig 3.
The pin 1 indicator is located on the lower left corner of the device, below the marking code.
Logic symbol
Logic diagram
Ordering information
Marking
2
Package
Temperature range Name
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
40 C to +125 C
A
mnb150
Y
A
4
All information provided in this document is subject to legal disclaimers.
TSSOP5
XSON6
XSON6
XSON6
XSON6
Rev. 4 — 15 July 2010
Description
plastic thin shrink small outline package; 5 leads;
body width 1.25 mm
plastic extremely thin small outline package; no leads;
6 terminals; body 1  1.45  0.5 mm
plastic extremely thin small outline package; no leads;
6 terminals; body 1  1  0.5 mm
extremely thin small outline package; no leads;
6 terminals; body 0.9  1.0  0.35 mm
extremely thin small outline package; no leads;
6 terminals; body 1.0  1.0  0.35 mm
Marking code
pJ
pJ
pJ
pJ
pJ
Fig 2.
IEC logic symbol
[1]
mnb152
Y
2
Low-power Schmitt trigger
74AUP1G17
mnb151
4
© NXP B.V. 2010. All rights reserved.
Version
SOT353-1
SOT886
SOT891
SOT1115
SOT1202
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