NLX2G07BMX1TCG ON Semiconductor, NLX2G07BMX1TCG Datasheet - Page 7

• Manufacturer Part Number: NLX2G07BMX1TCG
• Description: IC BUFFER DL N-INV OP/DR 6ULLGA
• Manufacturer: ON Semiconductor

Specifications of NLX2G07BMX1TCG

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 2
• Number Of Bits Per Element: 1
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 6-ULLGA
• Number Of Channels Per Chip: 2
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Screw
• Low Level Output Current: 32 mA
• Minimum Operating Temperature: - 55 C
• Number Of Lines (input / Output): 2 / 2
• Output Type: Open Drain
• Propagation Delay Time: 5.8 ns at 2.3 V to 2.7 V, 4.4 ns at 3 V to 3.6 V, 3.5 ns at 4.5 V to 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: Details

6X
REFERENCE
PIN ONE
0.10 C
0.05 C
0.05 C
0.10 C
L1
É É
É É É É
BOTTOM VIEW
SIDE VIEW
TOP VIEW
1
6
D
4
A1
3
e
6X
E
A
B
A
b
5X
0.10
0.05
C
L
SEATING
PLANE
NOTE 4
C
C
PACKAGE DIMENSIONS
A
NOTE 3
ULLGA6 1.2x1.0, 0.4P
B
http://onsemi.com
CASE 613AE-01
NLX2G07
ISSUE A
7
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.53
SOLDERMASK DEFINED*
MOUNTING FOOTPRINT
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
4. A MAXIMUM OF 0.05 PULL BACK OF THE
OUTLINE
ASME Y14.5M, 1994.
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
DIM
A1
PKG
L1
A
D
E
b
e
L
0.49
5X
1
MILLIMETERS
MIN
0.00
0.15
0.25
0.35
---
1.20 BSC
1.00 BSC
0.40 BSC
DIMENSIONS: MILLIMETERS
MAX
0.40
0.05
0.25
0.35
0.45
PITCH
1.24
0.40
0.26
6X