MSC8122MPLOX Freescale Semiconductor / Motorola, MSC8122MPLOX Datasheet

no-image

MSC8122MPLOX

Manufacturer Part Number
MSC8122MPLOX
Description
8122-LO SPEED-LEAD-BUFF.
Manufacturer
Freescale Semiconductor / Motorola
Datasheet
Freescale Semiconductor
Data Sheet:
Quad Digital Signal
Processor
• Four StarCore™ SC140 DSP extended cores, each with an SC140
• 475 Kbyte M2 memory for critical data and temporary data
• 4 Kbyte boot ROM.
• M2-accessible multi-core MQBus connecting the M2 memory
• Internal PLL configured are reset by configuration signal values.
• 60x-compatible system bus with 64 or 32 bit data and 32-bit
• Direct slave interface (DSI) using a 32/64-bit slave host interface
• Three mode signal multiplexing: 64-bit DSI and 32-bit system
• Flexible memory controller with three UPMs, a GPCM, a
© Freescale Semiconductor, Inc., 2004, 2008. All rights reserved.
DSP core, 224 Kbyte of internal SRAM M1 memory (1436 Kbyte
total), 16 way 16 Kbyte instruction cache (ICache), four-entry
write buffer, external cache support, programmable interrupt
controller (PIC), local interrupt controller (LIC), and low-power
Wait and Stop processing modes.
buffering.
with all four cores, operating at the core frequency, with data bus
access of up to 128-bit reads and up to 64-bit writes, central
efficient round-robin arbiter for core access to the bus, and atomic
operation control of M2 memory access by the cores and the local
bus.
address bus, support for multi-master designs, four-beat burst
transfers (eight-beat in 32-bit data mode), port size of 64/32/16/8
bits controlled by the internal memory controller,.access to
external memory or peripherals, access by an external host to
internal resources, slave support with direct access to internal
resources including M1 and M2 memories, and on-device
arbitration for up to four master devices.
with 21–25 bit addressing and 32/64-bit data transfers, direct
access by an external host to internal and external resources,
synchronous or asynchronous accesses with burst capability in
synchronous mode, dual or single strobe mode, write and read
buffers to improve host bandwidth, byte enable signals for
1/2/4/8-byte write granularity, sliding window mode for access
using a reduced number of address pins, chip ID decoding to
allow one CS signal to control multiple DSPs, broadcast mode to
write to multiple DSPs, and big-endian/little-endian/munged
support.
bus, 32-bit DSI and 64-bit system bus, or 32-bit DSI and 32-bit
system bus.
page-mode SDRAM machine, glueless interface to a variety of
memories and devices, byte enables for 64- or 32-bit bus widths,
• Multi-channel DMA controller with 16 time-multiplexed single
• Up to four independent TDM modules with programmable word
• Ethernet controller with support for 10/100 Mbps MII/RMII/SMII
• UART with full-duplex operation up to 6.25 Mbps.
• Up to 32 general-purpose input/output (GPIO) ports.
• I
• Two timer modules, each with sixteen configurable 16-bit timers.
• Eight programmable hardware semaphores.
• Global interrupt controller (GIC) with interrupt consolidation and
• Optional booting external memory, external host, UART, TDM,
8 memory banks for external memories, and 2 memory banks for
IPBus peripherals and internal memories.
channels, up to four external peripherals, DONE or DRACK
protocol for two external peripherals,.service for up to 16 internal
requests from up to 8 internal FIFOs per channel, FIFO generated
watermarks and hungry requests, priority-based
time-multiplexing between channels using 16 internal priority
levels or round-robin time-multiplexing between channels,
flexible channel configuration with connection to local bus or
system bus, and flyby transfer support that bypasses the FIFO.
size (2, 4, 8, or 16-bit), hardware-base A-law/μ-law conversion,
up to 128 Mbps data rate for all channels, with glueless interface
to E1 or T1 framers, and can interface with H-MVIP/H.110
devices, TSI, and codecs such as AC-97.
including full- and half-duplex operation, full-duplex flow
controls, out-of-sequence transmit queues, programmable
maximum frame length including jumbo frames and VLAN tags
and priority, retransmission after collision, CRC generation and
verification of inbound/outbound packets, address recognition
(including exact match, broadcast address, individual hash check,
group hash check, and promiscuous mode), pattern matching,
insertion with expansion or replacement for transmit frames,
VLAN tag insertion, RMON statistics, local bus master DMA for
descriptor fetching and buffer access, and optional multiplexing
with GPIO (MII/RMII/SMII) or DSI/system bus signals lines
(MII/RMII).
routing to INT_OUT, NMI_OUT, and the cores; thirty-two virtual
maskable interrupts (8 per core) and four virtual NMI (one per
core) that can be generated by a simple write access.
or I
2
C interface that allows booting from EEPROM devices.
2
C.
MSC8122
Document Number: MSC8122
FC PBGA–431
20 mm × 20 mm
Rev. 16, 12/2008

Related parts for MSC8122MPLOX

MSC8122MPLOX Summary of contents

Page 1

Freescale Semiconductor Data Sheet: Quad Digital Signal Processor • Four StarCore™ SC140 DSP extended cores, each with an SC140 DSP core, 224 Kbyte of internal SRAM M1 memory (1436 Kbyte total), 16 way 16 Kbyte instruction cache (ICache), four-entry write ...

Page 2

Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4 1.1 ...

Page 3

SC140 Extended Core MQBus Boot ROM M2 RAM PLL/Clock JTAG Port System Interface Program Sequencer SC140 Core JTAG Power Management Instruction Cache QBus Notes: 1. The arrows show the data transfer direction. 2. The QBus interface ...

Page 4

Pin Assignments 1 Pin Assignments This section includes diagrams of the MSC8122 package ball grid array layouts and pinout allocation tables. 1.1 FC-PBGA Ball Layout Diagrams Top and bottom views of the FC-PBGA package are shown in Figure 3 and ...

Page 5

NMI_ V B GND GND GND DD OUT GND TDO GPIO28 HCID1 DD RESET V D TDI EE0 EE1 GND HCID2 DDH TCK TRST TMS HRESET GPIO27 HCID0 E PO RST ...

Page 6

Pin Assignments GND GPIO0 GND GPIO6 GPIO5 GPIO3 GPIO7 GPIO1 GPIO2 GPIO30 GPIO8 GND GPIO4 GPIO29 GPIO31 DDH DDH GPIO12 GPIO10 GPIO13 GPIO9 ...

Page 7

Signal List By Ball Location Table 1 presents signal list sorted by ball number. - Table 1. MSC8122 Signal Listing by Ball Designator Des. Signal Name GND B5 GND B6 NMI_OUT B7 GND B8 V ...

Page 8

Pin Assignments Table 1. MSC8122 Signal Listing by Ball Designator (continued) Des. Signal Name E12 GND E13 V DD E14 GND E15 GND E16 V DD E17 GND E18 GND E19 GPIO9/TDM2TSYN/IRQ7/ETHMDIO E20 GPIO13/TDM2RCLK/IRQ11/ETHMDC E21 GPIO10/TDM2TCLK/IRQ8/ETHRX_DV/ETHCRS_DV/NC E22 GPIO12/TDM2RSYN/IRQ10/ETHRXD1/ETHSYNC F2 PORESET ...

Page 9

Table 1. MSC8122 Signal Listing by Ball Designator (continued) Des. Signal Name H21 V DDH H22 A31 J2 HA18 J3 HA26 HA13 J6 GND J7 PSDAMUX/PGPL5 J8 BADDR27 J10 CLKIN J11 BM2/TC2/BNKSEL2 J12 ...

Page 10

Pin Assignments Table 1. MSC8122 Signal Listing by Ball Designator (continued) Des. Signal Name M15 V DDH M16 HBRST M17 V DDH M18 V DDH M19 GND M20 V DDH M21 A24 M22 A21 N2 HD26 N3 HD30 N4 HD29 ...

Page 11

Table 1. MSC8122 Signal Listing by Ball Designator (continued) Des. Signal Name T6 HWBS7/HDBS7/HWBE7/HDBE7/PWE7/PSDDQM7/PBS7 T7 HWBS5/HDBS5/HWBE5/HDBE5/PWE5/PSDDQM5/PBS5 T8 TSZ0 T9 TSZ2 T10 TBST T11 V DD T12 D16 T13 TT1 T14 D21 T15 D23 T16 IRQ5/DP5/DACK4/EXT_BG3 T17 IRQ4/DP4/DACK3/EXT_DBG3 T18 IRQ1/DP1/DACK1/EXT_BG2 T19 ...

Page 12

Pin Assignments Table 1. MSC8122 Signal Listing by Ball Designator (continued) Des. Signal Name W15 V DDH W16 HD33/D33/reserved W17 V DDH W18 HD32/D32/reserved W19 GND W20 GND W21 A7 W22 A6 Y2 HD7 Y3 HD15 Y4 V DDH Y5 ...

Page 13

Electrical Characteristics This document contains detailed information on power considerations, DC/AC electrical characteristics, and AC timing specifications. For additional information, see the MSC8122 Reference Manual. 2.1 Maximum Ratings This device contains circuitry protecting against damage due to high static ...

Page 14

Electrical Characteristics 2.2 Recommended Operating Conditions Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed. Table 3. Recommended Operating Conditions Rating Core and PLL supply voltage: • Standard — 400 MHz — 500 ...

Page 15

DC Electrical Characteristics This section describes the DC electrical characteristics for the MSC8122. The measurements in Table 5 assume the following system conditions: • °C A • — 300/400 MHz 1.1 V nominal ...

Page 16

Electrical Characteristics V + 17% DDH DDH V GND V IL GND – 0.3 V GND – 0.7 V Figure 5. Overshoot/Undershoot Voltage for V 2.5 AC Timings The following sections include illustrations and tables ...

Page 17

V 2.2 V 1.2 V o.5 V Figure 6. Start-Up Sequence: V 3.3 V 1.2 V o.5 V PORESET/TRST asserted V applied DD Figure 7. Start-Up Sequence: V MSC8122 Quad Digital Signal Processor Data Sheet, Rev. 16 Freescale Semiconductor ...

Page 18

Electrical Characteristics In all cases, the power-up sequence must follow the guidelines shown in Figure 1.2 V Figure 8. Power-Up Sequence for V The following rules apply: 1. During time interval A, V DDH The ...

Page 19

Characteristic Phase jitter between BCLK and CLKIN CLKIN frequency CLKIN slope 1 CLKIN period jitter CLKIN jitter spectrum PLL input clock (after predivider) PLL output frequency (VCO output) • 300 MHz core • 400 MHz core • 500 MHz core ...

Page 20

Electrical Characteristics Table 11 summarizes the reset actions that occur as a result of the different reset sources. Table 11. Reset Actions for Each Reset Source Reset Action/Reset Source Configuration pins sampled (Refer to Section 2.5.4.1 for details). SPLL state ...

Page 21

Reset Timing Tables Table 12 and Figure 9 describe the reset timing for a reset configuration write through the direct slave interface (DSI) or through the system bus. Table 12. Timing for a Reset Configuration Write through the DSI ...

Page 22

Electrical Characteristics 2.5.5 System Bus Access Timing 2.5.5.1 Core Data Transfers Generally, all MSC8122 bus and system output signals are driven from the rising edge of the reference clock (REFCLK). The REFCLK is the CLKIN signal. Memory controller signals, however, ...

Page 23

The UPM machine and GPCM machine outputs change on the internal tick selected by the memory controller configuration. The AC timing specifications are relative to the internal tick. SDRAM machine outputs change only on the No. Characteristic 10 Hold time ...

Page 24

Electrical Characteristics No. Characteristic 2 30 Minimum delay from the 50% level of the REFCLK for all signals 31 PSDVAL/TEA/TA max delay from the 50% level of the REFCLK rising edge 32a Address bus max delay from the 50% level ...

Page 25

AACK/ARTRY/TA/TEA/DBG/BG/BR Data bus inputs—normal mode Data bus inputs—ECC and parity modes Address bus/TS /TT[0–4]/TC[0–2]/ TBST/TSZ[0–3]/GBL inputs Address bus/TT[0–4]/TC[0–2]/TBST/TSZ[0–3]/GBL outputs Memory controller/ALE outputs AACK/ABB/TS/DBG/BG/BR/DBB/CS outputs MSC8122 Quad Digital Signal Processor Data Sheet, Rev. 16 Freescale Semiconductor REFCLK 11 PSDVAL/ABB/DBB inputs 12 ...

Page 26

Electrical Characteristics 2.5.5.2 CLKIN to CLKOUT Skew Table 17 describes the to- CLKOUT- CLKIN No. Characteristic 20 Rise-to-rise skew • 1 • 1 Fall-to-fall skew • 1 ...

Page 27

DMA Data Transfers Table 17 describes the DMA signal timing. No. Characteristic 37 DREQ set-up time before the 50% level of the falling edge of REFCLK 38 DREQ hold time after the 50% level of the falling edge of ...

Page 28

Electrical Characteristics 2.5.6 DSI Timing The timings in the following sections are based capacitive load. 2.5.6.1 DSI Asynchronous Mode No. Characteristics 1 100 Attributes set-up time before strobe (HWBS[n]) assertion 1 101 Attributes hold time after ...

Page 29

Figure 14 shows DSI asynchronous read signals timing. HCS HA[11–29] HCID[0–4] HDST 1 HRW 2 HWBSn 1 HDBSn 2 HRDS HD[0–63] 3 HTA 4 HTA Notes: 1. Used for single-strobe mode access. 2. Used for dual-strobe mode access. 3. HTA ...

Page 30

Electrical Characteristics Figure 15 shows DSI asynchronous write signals timing. HCS HA[11–29] HCID[0–4] HDST 1 HRW 2 HRDS 1 HDBSn 2 HWBSn HD[0–63] 3 HTA 4 HTA Notes: 1. Used for single-strobe mode access. 2. Used for dual-strobe mode access. ...

Page 31

DSI Synchronous Mode No. Characteristic 1,2 120 HCLKIN cycle time 121 HCLKIN high pulse width 122 HCLKIN low pulse width 123 HA[11–29] inputs set-up time 124 HD[0–63] inputs set-up time 125 HCID[0–4] inputs set-up time 126 All other inputs ...

Page 32

Electrical Characteristics 2.5.7 TDM Timing No. Characteristic 300 TDMxRCLK/TDMxTCLK 301 TDMxRCLK/TDMxTCLK high pulse width 302 TDMxRCLK/TDMxTCLK low pulse width 303 TDM receive all input set-up time 304 TDM receive all input hold time 305 TDMxTCLK high to TDMxTDAT/TDMxRCLK output 2,3 ...

Page 33

UART Timing No. Characteristics 400 URXD and UTXD inputs high/low duration 401 URXD and UTXD inputs rise/fall time 402 UTXD output rise/fall time UTXD, URXD inputs UTXD output MSC8122 Quad Digital Signal Processor Data Sheet, Rev. 16 Freescale Semiconductor ...

Page 34

Timer Timing No. 500 TIMERx frequency 501 TIMERx Input high period 502 TIMERx Output low period 503 TIMERx Propagations delay from its clock input • 1.1 V core • 1.2 V core TIMERx (Input) TIMERx (Output) 2.5.10 Ethernet Timing ...

Page 35

MII Mode Timing No. 803 ETHRX_DV, ETHRXD[0–3], ETHRX_ER to ETHRX_CLK rising edge set-up time 804 ETHRX_CLK rising edge to ETHRX_DV, ETHRXD[0–3], ETHRX_ER hold time 805 ETHTX_CLK to ETHTX_EN, ETHTXD[0–3], ETHTX_ER output delay • 1.1 V core • 1.2 V ...

Page 36

SMII Mode No. 808 ETHSYNC_IN, ETHRXD to ETHCLOCK rising edge set-up time 809 ETHCLOCK rising edge to ETHSYNC_IN, ETHRXD hold time 810 ETHCLOCK rising edge to ETHSYNC, ETHTXD output delay • 1.1 V core. • 1.2 V core. Notes: ...

Page 37

REFCLK 603 GPIO (Output) GPIO (Input) 2.5.12 EE Signals Number Characteristics 65 EE0 (input) 66 EE1 (output) Notes: 1. The core clock is the SC140 core clock. The ratio between the core clock and CLKOUT is configured during power-on-reset. 2. ...

Page 38

No. 704 Boundary scan input data set-up time 705 Boundary scan input data hold time 706 TCK low to output data valid 707 TCK low to output high impedance 708 TMS, TDI data set-up time 709 TMS, TDI data hold ...

Page 39

TCK V (Input) IL TDI TMS (Input) TDO (Output) TDO (Output) Figure 31. Test Access Port Timing Diagram TCK (Input) TRST (Input) 712 3 Hardware Design Considerations The following sections discuss areas to consider when the MSC8122 device is designed ...

Page 40

Hardware Design Considerations • Never allow V to exceed V DD supply to prevent reverse current flow by adding a minimum 10 Ω resistor to GND to limit the • Design the V DDH current. Such a design yields an ...

Page 41

Figure 34. For optimal noise filtering, place the circuit as close as possible followed by the 10-µF capacitor, the 10-nH inductor, and finally the 10-Ω resistor to V CCSYN kept short and direct. Provide an extremely low ...

Page 42

Hardware Design Considerations Note: The MSC8122 does not support DLL-enabled mode. For the following two clock schemes, ensure that the DLL is disabled (that is, the DLLDIS bit in the Hard Reset Configuration Word is set). • system ...

Page 43

Thermal Considerations An estimation of the chip-junction temperature where T = ambient temperature near the package (° θ = junction-to-ambient thermal resistance (°C/ power dissipation in the package (W) D ...

Page 44

Package Information 5 Package Information Figure 35. MSC8122 Mechanical Information, 431-pin FC-PBGA Package 6 Product Documentation • MSC8122 Technical Data Sheet (MSC8122). Details the signals, AC/DC characteristics, clock signal characteristics, package and pinout, and electrical design considerations of the MSC8122 ...

Page 45

Revision History Table 31 provides a revision history for this data sheet. Revision Date 0 May 2004 • Initial release. 1 Jun. 2004 • Updated timing number 32b. • Updated DSI timing specifications. 2 Sep 2004 • New orderable ...

Page 46

Revision History MSC8122 Quad Digital Signal Processor Data Sheet, Rev Freescale Semiconductor ...

Page 47

MSC8122 Quad Digital Signal Processor Data Sheet, Rev. 16 Freescale Semiconductor Revision History 47 ...

Page 48

How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. Technical Information Center, EL516 2100 East Elliot Road Tempe, Arizona 85284 +1-800-521-6274 or +1-480-768-2130 www.freescale.com/support Europe, Middle East, and Africa: Freescale Halbleiter ...

Related keywords