MSC8122MPLOX Freescale Semiconductor / Motorola, MSC8122MPLOX Datasheet - Page 14

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MSC8122MPLOX

Manufacturer Part Number
MSC8122MPLOX
Description
8122-LO SPEED-LEAD-BUFF.
Manufacturer
Freescale Semiconductor / Motorola
Datasheet
Electrical Characteristics
2.2
Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed.
2.3
Table 4 describes thermal characteristics of the MSC8122 for the FC-PBGA packages.
Section 3.5, Thermal Considerations provides a detailed explanation of these characteristics.
14
Junction-to-ambient
Junction-to-ambient, four-layer board
Junction-to-board (bottom)
Junction-to-case
Junction-to-package-top
Notes:
Core and PLL supply voltage:
• Standard
• Reduced (300 and 400 MHz)
I/O supply voltage
Input voltage
Operating temperature range:
• Standard
• Extended
— 400 MHz
— 500 MHz
1.
2.
3.
4.
5.
6.
Recommended Operating Conditions
Thermal Characteristics
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2.
5
1, 2
Characteristic
6
4
Rating
MSC8122 Quad Digital Signal Processor Data Sheet, Rev. 16
1, 3
Table 4. Thermal Characteristics for the MSC8122
Table 3. Recommended Operating Conditions
Symbol
R
R
R
R
Ψ
θJC
θJA
θJA
θJB
JT
Symbol
V
V
CCSYN
V
V
DDH
T
T
DD
IN
Convection
J
J
Natural
0.9
26
19
9
1
20
FC-PBGA
×
–0.2 to V
20 mm
3.135 to 3.465
1.14 to 1.26
1.16 to 1.24
1.07 to 1.13
–40 to 105
0 to 90
(1 m/s) airflow
Value
200 ft/min
5
DDH
Freescale Semiconductor
21
15
+0.2
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
°C
°C
V
V
V
V
V

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