IXDD430 IXYS Corporation, IXDD430 Datasheet - Page 5

• Manufacturer Part Number: IXDD430
• Description: 30 Amp Low-Side Ultrafast MOSFET / IGBT Driver
• Manufacturer: IXYS Corporation

Figure 2 - Characteristics Test Diagram
Pin Configurations
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD procedures when
handling and assembling this component.
* This pin is used only on the IXDD430, and is N/C (not connected) on the IXDI430 and IXDN430.
Pin Description
SYMBOL
UVSEL
OUT P
OUT N
GND
VCC
EN *
INV
IN
UVSEL 6
GND 13
GND 14
INV 10
GND 11
GND 12
Vcc 1
Vcc 2
Vcc 3
Vcc 4
N/C 5
N/C 7
Supply Voltage
Voltage Level
Select Under
IN 8
EN 9
FUNCTION
Ground
Enable
Output
Invert
Input
C
FILTER
BYPASS/
28 Pin SOIC
(SI-CT)
.
Positive power-supply voltage input. This pin provides power to the
entire chip. The range for this voltage is from 8.5V to 35V.
Input signal-TTL or CMOS compatible.
The system enable pin. This pin, when driven low, disables the chip,
forcing high impedance state to the output (IXDD430 Only).
Forcing INV low causes the IXDS430 to become non-inverted, while
forcing INV high causes the IXDS430 to become inverted.
Respective P and N driver outputs. For application purposes this pin
is connected, through a resistor, to Gate of a MOSFET/IGBT. The P
and N output pins are connected together in the TO-263 and TO-220
packages.
The system ground pin. Internally connected to all circuitry, this pin
provides ground reference for the entire chip. This pin should be
connected to a low noise analog ground plane for optimum
performance.
W ith UVSEL connected to Vcc, IXDS430 outputs go low at Vcc <
8.5V; W ith UVSEL open, under voltage level is set at Vcc < 12.5V
+
-
Vcc
C
LOAD
28 Vcc
27 Vcc
26 Vcc
25 Vcc
24 OUT P
23 OUT P
22 OUT P
21 OUT N
20 OUT N
19 OUT N
18 GND
17 GND
16 GND
15 GND
+
-
.
Vin
5
IXDN430 / IXDI430 / IXDD430 / IXDS430
Vcc
OUT
GND
IN
EN
DESCRIPTION
IXDD430
1
2
3
4
5
TO220 (CI)
TO263 (YI)
OU T
GND
E N *
Vcc
IN